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NTTFS002N04CTAG

Onsemi

NTTFS002N04CTAG by Onsemi

NTTFS002N04CTAG by Onsemi is a Power FET with 40V DS Breakdown Voltage, 27A Drain Current, and 0.0024 ohm On Resistance. It is an N-CHANNEL MOSFET suitable for applications requiring high power dissipation in small outline packages. Operating from -55 to 175 °C, it features a built-in diode and matte tin finish for enhanced performance.

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 670 parts In-Stock

1+ parts

$1.710

100+ parts

$0.721

1k+ parts

$0.567

10k+ parts

-

670

$1.710

$0.721

$0.567

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Distributors (In-Stock)

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Digiode

USA . 653 parts In-Stock

1+ parts

$1.986

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-

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653

$1.986

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Chip Stock

USA . 34,000 parts In-Stock

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34,000

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Vyrian

USA . 10,422 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

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Corohmni

South Africa . 141 parts In-Stock

1+ parts

$1.690

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141

$1.690

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Corphita

USA . 609 parts In-Stock

1+ parts

$1.881

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609

$1.881

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Microchip USA

USA . 8,120 parts In-Stock

1+ parts

$7.023

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8,120

$7.023

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Component Stockers USA

USA . 5,683 parts In-Stock

1+ parts

$16.720

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5,683

$16.720

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SupplyDigital Components

Austria . 8,200 parts In-Stock

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8,200

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Kulean Microsystems

USA . 6,803 parts In-Stock

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6,803

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Problanco Electronics

Mexico . 5,595 parts In-Stock

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5,595

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 2,244 parts In-Stock

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2,244

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UHIMA Technologies

Türkiye . 321 parts In-Stock

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321

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Overview

Power up your applications with the NTTFS002N04CTAG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their Power Field Effect Transistors (FET). With a single configuration and built-in diode, this N-channel transistor offers enhanced performance and efficiency. Suitable for a variety of applications, this FET is designed to meet the demands of modern technology. Experience the value and benefits of the NTTFS002N04CTAG and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for long-term use in various applications.

Polarity or Channel Type: N-CHANNEL

Suitable for use in circuits where N-channel FETs are needed for proper functionality.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design that includes a built-in diode for added functionality and efficiency.

Surface Mount: YES

Easily mountable on PCBs for efficient integration into electronic devices.

Minimum DS Breakdown Voltage: 40 V

Can withstand high voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 676 A

Capable of handling high current loads for demanding applications.

Maximum Power Dissipation (Abs): 85 W

Efficient heat dissipation capabilities for high-power operation without overheating.

Maximum Operating Temperature: 175 °C

Can operate effectively in a wide temperature range, suitable for various environments.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS002N04CTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

268 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.0024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

41 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

676 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTTFS002N04CTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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