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NTTFS6H850NTAG

Onsemi

NTTFS6H850NTAG by Onsemi

NTTFS6H850NTAG by Onsemi is an N-channel Power FET with 80V DS breakdown voltage and 300A IDM. Ideal for applications requiring high power dissipation, it operates in enhancement mode with a drain-source resistance of 0.017 ohm. Suitable for various electronic devices due to its small outline package style and wide operating temperature range from -55 to 175°C.

Median Price

$0.795

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 535 parts In-Stock

1+ parts

$0.189

100+ parts

$0.180

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$0.174

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535

$0.189

$0.180

$0.174

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$0.578

100+ parts

$0.434

1k+ parts

$0.397

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1,000

$0.578

$0.434

$0.397

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Farnell

UK . 470 parts In-Stock

1+ parts

$0.795

100+ parts

$0.421

1k+ parts

$0.369

10k+ parts

$0.330

470

$0.795

$0.421

$0.369

$0.330

Mouser Electronics

USA . 12 parts In-Stock

1+ parts

$1.890

100+ parts

$0.779

1k+ parts

$0.483

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12

$1.890

$0.779

$0.483

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Element14

Singapore . 2,590 parts In-Stock

1+ parts

$1.983

100+ parts

$1.342

1k+ parts

$1.014

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2,590

$1.983

$1.342

$1.014

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RS (Exports)

UK . 1,490 parts In-Stock

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100+ parts

$1.249

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$0.903

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1,490

-

$1.249

$0.903

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Verical

USA . 535 parts In-Stock

1+ parts

-

100+ parts

$0.180

1k+ parts

$0.174

10k+ parts

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535

-

$0.180

$0.174

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 585 parts In-Stock

1+ parts

$0.428

100+ parts

-

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585

$0.428

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Tomark Electronics Ltd

UK . 15,388 parts In-Stock

1+ parts

$0.710

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-

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15,388

$0.710

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Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$1.280

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46

$1.280

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Flip Electronics

USA . 22,500 parts In-Stock

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22,500

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Chip Stock

USA . 15,200 parts In-Stock

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15,200

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Vyrian

USA . 2,005 parts In-Stock

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NexGen Digital

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,877 parts In-Stock

1+ parts

$0.348

100+ parts

$0.339

1k+ parts

$0.338

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1,877

$0.348

$0.339

$0.338

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Ampacity Inc.

Singapore . 1,429 parts In-Stock

1+ parts

$0.348

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1,429

$0.348

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Corohmni

South Africa . 306 parts In-Stock

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$0.372

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306

$0.372

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Corphita

USA . 686 parts In-Stock

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$0.406

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686

$0.406

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Aztec Data Supply Inc.

USA . 101 parts In-Stock

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$0.600

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101

$0.600

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Argo Parts USA

USA . 3,376 parts In-Stock

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$1.280

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3,376

$1.280

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Continental Prestige Electronics

USA . 3,270 parts In-Stock

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$1.280

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$1.254

3,270

$1.280

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$1.254

Component Stockers USA

USA . 21,989 parts In-Stock

1+ parts

$1.870

100+ parts

$1.220

1k+ parts

$0.830

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21,989

$1.870

$1.220

$0.830

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Microchip USA

USA . 4,838 parts In-Stock

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$6.642

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$6.642

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Lixinc

USA . 10,943 parts In-Stock

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TANS Electronics

Latvia . 7,194 parts In-Stock

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Problanco Electronics

Mexico . 6,805 parts In-Stock

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Perfect Parts

USA . 3,013 parts In-Stock

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SupplyDigital Components

Austria . 2,467 parts In-Stock

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2,467

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UHIMA Technologies

Türkiye . 278 parts In-Stock

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Kulean Microsystems

USA . 71 parts In-Stock

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Overview

Experience the power and reliability of the NTTFS6H850NTAG Power Field Effect Transistor by Onsemi. With a single configuration and built-in diode, this N-CHANNEL transistor offers enhanced performance for a wide range of applications. From automotive to industrial, this transistor provides superior efficiency and durability, ensuring optimal functionality in any project. Trust in the quality and innovation of Onsemi to deliver the best solutions for your electronic needs. Elevate your designs with the NTTFS6H850NTAG and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current-handling capabilities compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency and reliability of the FET in certain circuit applications.

Surface Mount: YES

Surface mount technology allows for easier and more compact installation on PCBs.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes this FET suitable for a wide range of industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS6H850NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

271 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

68 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTTFS6H850NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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