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NTTFS5116PLTWG

Onsemi

NTTFS5116PLTWG by Onsemi

NTTFS5116PLTWG by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 76A and EAS of 45mJ, operating in ENHANCEMENT MODE. With a compact SQUARE package style and high power dissipation of 40W, it offers efficient performance in various electronic devices.

Median Price

$0.675

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 9,040 parts In-Stock

1+ parts

$2.920

100+ parts

$0.976

1k+ parts

$0.638

10k+ parts

-

9,040

$2.920

$0.976

$0.638

-

Future Electronics

Canada . 10,000 parts In-Stock

1+ parts

-

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$0.400

10,000

-

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$0.400

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$0.675

5,000

-

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$0.675

Distributors (In-Stock)

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Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$0.373

100+ parts

-

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77

$0.373

-

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Digiode

USA . 1,631 parts In-Stock

1+ parts

$0.770

100+ parts

-

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1,631

$0.770

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Chip Stock

USA . 72,000 parts In-Stock

1+ parts

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72,000

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Flip Electronics

USA . 20,000 parts In-Stock

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20,000

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Vyrian

USA . 18,471 parts In-Stock

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18,471

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NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.736

10,000

-

-

-

$0.736

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 104 parts In-Stock

1+ parts

$0.347

100+ parts

-

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104

$0.347

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Continental Prestige Electronics

USA . 6,638 parts In-Stock

1+ parts

$0.373

100+ parts

-

1k+ parts

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10k+ parts

$0.365

6,638

$0.373

-

-

$0.365

Argo Parts USA

USA . 3,699 parts In-Stock

1+ parts

$0.373

100+ parts

-

1k+ parts

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10k+ parts

$0.361

3,699

$0.373

-

-

$0.361

Semicontronic

India . 18,575 parts In-Stock

1+ parts

$0.690

100+ parts

$0.673

1k+ parts

$0.669

10k+ parts

-

18,575

$0.690

$0.673

$0.669

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Ampacity Inc.

Singapore . 18,478 parts In-Stock

1+ parts

$0.690

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18,478

$0.690

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Corphita

USA . 1,848 parts In-Stock

1+ parts

$0.729

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1,848

$0.729

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Aztec Data Supply Inc.

USA . 156 parts In-Stock

1+ parts

$1.220

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156

$1.220

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.962

100+ parts

$1.864

1k+ parts

$1.864

10k+ parts

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1,000

$1.962

$1.864

$1.864

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Lixinc

USA . 18,591 parts In-Stock

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18,591

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SupplyDigital Components

Austria . 6,541 parts In-Stock

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6,541

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TANS Electronics

Latvia . 5,023 parts In-Stock

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Problanco Electronics

Mexico . 3,316 parts In-Stock

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Kulean Microsystems

USA . 3,200 parts In-Stock

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UHIMA Technologies

Türkiye . 798 parts In-Stock

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798

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$0.365

1k+ parts

$0.354

10k+ parts

$0.346

50

-

$0.365

$0.354

$0.346

Overview

Elevate your power management capabilities with the NTTFS5116PLTWG by Onsemi. Crafted with precision and expertise, this P-CHANNEL Power Field Effect Transistor boasts a built-in diode for seamless switching applications. Unleash its potential in a variety of industries and projects, from automotive to industrial electronics. With Onsemi's reputation for quality and reliability, this transistor offers unmatched performance and efficiency. Enhance your designs and elevate your projects with the NTTFS5116PLTWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the internal components of the FET, making it reliable for long-term use.

Polarity or Channel Type: P-CHANNEL

The P-channel type FET allows for efficient switching and control of power flow, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against voltage spikes, enhancing the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and low power consumption, ideal for efficient energy management.

Surface Mount: YES

Being surface mountable makes the installation of this FET easy and convenient, saving space and allowing for high-density circuit designs.

Maximum Drain-Source On Resistance: 0.052 ohm

With a low on-resistance, this FET minimizes power losses and heat generation, improving overall efficiency and performance in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS5116PLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

45 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

5.7 A

Maximum Drain-Source On Resistance:

.052 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

84 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS5116PLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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