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NTTFS4C02NTAG

Onsemi

NTTFS4C02NTAG by Onsemi

NTTFS4C02NTAG by Onsemi is a power FET with N-channel configuration and built-in diode, ideal for switching applications. It features a max drain current of 16A, operating temperature range from -55 to 150°C, and low on-resistance of 0.0031 ohm. This MOSFET has a package style of small outline with matte tin terminal finish.

Median Price

$0.694

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 903 parts In-Stock

1+ parts

$0.708

100+ parts

$0.447

1k+ parts

-

10k+ parts

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903

$0.708

$0.447

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-

DigiKey

USA . 441 parts In-Stock

1+ parts

$1.020

100+ parts

$0.416

1k+ parts

$0.321

10k+ parts

$0.218

441

$1.020

$0.416

$0.321

$0.218

Flip Electronics (Authorized)

USA . 4,416,000 parts In-Stock

1+ parts

-

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4,416,000

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Rochester

USA . 4,012 parts In-Stock

1+ parts

-

100+ parts

$0.281

1k+ parts

$0.234

10k+ parts

$0.208

4,012

-

$0.281

$0.234

$0.208

Verical

USA . 2,512 parts In-Stock

1+ parts

-

100+ parts

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$0.260

2,512

-

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$0.260

Arrow

USA . 633 parts In-Stock

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633

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RS (Exports)

UK . 200 parts In-Stock

1+ parts

-

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$0.694

200

-

-

-

$0.694

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 95 parts In-Stock

1+ parts

$0.426

100+ parts

-

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95

$0.426

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Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$0.851

100+ parts

-

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24

$0.851

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Flip Electronics

USA . 4,416,000 parts In-Stock

1+ parts

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100+ parts

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4,416,000

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Vyrian

USA . 553,717 parts In-Stock

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553,717

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Chip Stock

USA . 194,670 parts In-Stock

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194,670

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Cyclops Electronics Ltd

UK . 4,139 parts In-Stock

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4,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 553,787 parts In-Stock

1+ parts

$0.368

100+ parts

$0.359

1k+ parts

$0.357

10k+ parts

-

553,787

$0.368

$0.359

$0.357

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Ampacity Inc.

Singapore . 553,456 parts In-Stock

1+ parts

$0.368

100+ parts

-

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553,456

$0.368

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Corphita

USA . 990 parts In-Stock

1+ parts

$0.403

100+ parts

-

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990

$0.403

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-

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Corohmni

South Africa . 174 parts In-Stock

1+ parts

$0.433

100+ parts

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174

$0.433

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-

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Argo Parts USA

USA . 2,471 parts In-Stock

1+ parts

$0.851

100+ parts

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2,471

$0.851

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Continental Prestige Electronics

USA . 613 parts In-Stock

1+ parts

$0.851

100+ parts

-

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-

10k+ parts

$0.834

613

$0.851

-

-

$0.834

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.851

100+ parts

$0.834

1k+ parts

-

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500

$0.851

$0.834

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Microchip USA

USA . 7,511 parts In-Stock

1+ parts

$5.341

100+ parts

-

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7,511

$5.341

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Authorized Procurement Solutions

USA . 82,595 parts In-Stock

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82,595

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RC Electronics

USA . 36,491 parts In-Stock

1+ parts

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100+ parts

$0.940

1k+ parts

$0.860

10k+ parts

$0.830

36,491

-

$0.940

$0.860

$0.830

Lixinc

USA . 14,669 parts In-Stock

1+ parts

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14,669

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Problanco Electronics

Mexico . 8,200 parts In-Stock

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Kulean Microsystems

USA . 8,182 parts In-Stock

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Futuretech Components

Singapore . 7,500 parts In-Stock

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7,500

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TANS Electronics

Latvia . 6,249 parts In-Stock

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6,249

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SupplyDigital Components

Austria . 922 parts In-Stock

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922

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UHIMA Technologies

Türkiye . 371 parts In-Stock

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371

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Allen Electronics Distributors

USA . 200 parts In-Stock

1+ parts

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100+ parts

$0.949

1k+ parts

$0.676

10k+ parts

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200

-

$0.949

$0.676

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Overview

Experience the power of innovation with the NTTFS4C02NTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are perfect for various switching applications. With a single configuration and built-in diode, this transistor offers enhanced performance and reliability. Say goodbye to overheating and inefficiency with the NTTFS4C02NTAG, designed to handle high currents and temperatures with ease. Trust Onsemi to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient control of power flow in electronic circuits.

Surface Mount: YES

This feature makes installation easier and allows for compact and efficient PCB design.

Maximum Pulsed Drain Current (IDM): 500 A

High current rating allows for handling large transient currents, making it suitable for high-power applications.

Maximum Drain Current (Abs) (ID): 16 A

Sufficient current handling capacity for a wide range of electronic devices and circuits.

Maximum Power Dissipation (Abs): 2.7 W

Efficient power dissipation capability, ensuring the FET remains within safe operating temperatures during usage.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for demanding industrial environments.

Maximum Drain-Source On Resistance: 0.0031 ohm

Low on-resistance leads to reduced power losses and improved efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS4C02NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

162 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

55 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

500 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4C02NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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