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NTP18N06LG

Onsemi

NTP18N06LG by Onsemi

NTP18N06LG by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 45A IDM, and 0.1 ohm RDS(on). Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 175 °C, making it suitable for high-power tasks.

Median Price

$0.480

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 66,911 parts In-Stock

1+ parts

-

100+ parts

$0.462

1k+ parts

$0.384

10k+ parts

$0.342

66,911

-

$0.462

$0.384

$0.342

DigiKey

USA . 66,911 parts In-Stock

1+ parts

-

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$0.580

10k+ parts

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66,911

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-

$0.580

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Verical

USA . 66,911 parts In-Stock

1+ parts

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$0.480

10k+ parts

$0.428

66,911

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-

$0.480

$0.428

Distributors (In-Stock)

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Digiode

USA . 930 parts In-Stock

1+ parts

$0.360

100+ parts

-

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930

$0.360

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DF Sales Co.

USA . 154 parts In-Stock

1+ parts

$0.400

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154

$0.400

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DF Sales Co.

USA . 154 parts In-Stock

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$0.400

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154

$0.400

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Chip Stock

USA . 30,000 parts In-Stock

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30,000

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Vyrian

USA . 8,305 parts In-Stock

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8,305

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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Distributors (Availability)

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Corphita

USA . 1,825 parts In-Stock

1+ parts

$0.341

100+ parts

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1,825

$0.341

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Corohmni

South Africa . 211 parts In-Stock

1+ parts

$0.379

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211

$0.379

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AZTECH Wire

Italy . 426 parts In-Stock

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$17.550

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426

$17.550

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Continental Prestige Electronics

USA . 73,637 parts In-Stock

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$0.348

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73,637

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$0.348

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QUARKTWIN TECHNOLOGY LTD

USA . 14,457 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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TANS Electronics

Latvia . 6,808 parts In-Stock

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Problanco Electronics

Mexico . 5,028 parts In-Stock

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5,028

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Kulean Microsystems

USA . 3,505 parts In-Stock

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3,505

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,518 parts In-Stock

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1,518

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SupplyDigital Components

Austria . 1,142 parts In-Stock

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UHIMA Technologies

Türkiye . 884 parts In-Stock

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Metaverse IC Inc.

Canada . 796 parts In-Stock

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Overview

Unleash the power of innovation with the NTP18N06LG by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a robust design and built-in diode, this N-CHANNEL transistor delivers reliability and efficiency like no other. Whether you're looking to enhance your electronic projects or optimize your systems, the NTP18N06LG is the ultimate solution. Trust in Onsemi's legacy of excellence and revolutionize your technology with this cutting-edge component. Elevate your creations with the NTP18N06LG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good protection and insulation for the power field effect transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance compared to P-channel transistors, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage allows for reliable operation in high voltage circuits.

Maximum Pulsed Drain Current (IDM): 45 A

The high pulsed drain current rating enables the transistor to handle surges and peak loads effectively.

Maximum Power Dissipation (Abs): 48.4 W

The high power dissipation rating indicates the transistor can handle high power loads without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures the transistor can operate reliably in a wide range of temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTP18N06LG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP18N06LG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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