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NTP18N06L

Onsemi

NTP18N06L by Onsemi

NTP18N06L by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, 45A IDM, and 0.1 ohm RDS(on). Ideal for switching applications due to its single configuration with built-in diode. Operates in enhancement mode at max temp of 175 °C, making it suitable for high-power tasks.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 233 parts In-Stock

1+ parts

-

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$0.515

1k+ parts

$0.428

10k+ parts

$0.381

233

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$0.515

$0.428

$0.381

Distributors (In-Stock)

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Digiode

USA . 384 parts In-Stock

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$0.401

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384

$0.401

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Chip Stock

USA . 42,000 parts In-Stock

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42,000

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Vyrian

USA . 12,106 parts In-Stock

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ComSIT Distribution GmbH

Germany . 297 parts In-Stock

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LWI Electronics Inc

India . 50 parts In-Stock

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50

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Prism Electronics

USA . 7 parts In-Stock

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Corphita

USA . 1,763 parts In-Stock

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$0.380

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$0.380

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Corohmni

South Africa . 83 parts In-Stock

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$0.422

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83

$0.422

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Component Stockers USA

USA . 3,070 parts In-Stock

1+ parts

$0.430

100+ parts

$0.410

1k+ parts

$0.910

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-

3,070

$0.430

$0.410

$0.910

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AZTECH Wire

Italy . 127 parts In-Stock

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$17.270

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Kepictronics

USA . 13,000 parts In-Stock

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,701 parts In-Stock

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SupplyDigital Components

Austria . 7,471 parts In-Stock

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Metaverse IC Inc.

Canada . 5,010 parts In-Stock

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Problanco Electronics

Mexico . 4,565 parts In-Stock

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Kulean Microsystems

USA . 3,006 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,503 parts In-Stock

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TANS Electronics

Latvia . 1,272 parts In-Stock

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of efficient switching with the NTP18N06L by Onsemi. Designed with quality and precision, this N-channel Power FET offers reliable performance in a variety of applications. From enhancing power efficiency to optimizing circuit design, this transistor provides value and benefits that exceed expectations. Trust in Onsemi's reputation for excellence and elevate your projects with the NTP18N06L.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have lower ON resistance and faster switching speeds compared to P-Channel FETs, making this product efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient protection against reverse current flow, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Maximum Pulsed Drain Current (IDM): 45 A

Capable of handling high pulsed current loads, making it suitable for applications with occasional high current demands.

Maximum Drain Current (ID): 15 A

With a maximum continuous drain current of 15 A, this FET is suitable for a wide range of medium to high-power applications.

Maximum Power Dissipation (Abs): 48.4 W

With a high power dissipation rating, this FET can handle significant power levels without overheating.

Maximum Operating Temperature: 175 °C

Can operate efficiently at high temperatures, suitable for environments where temperature fluctuation is a concern.

Maximum Drain-Source On Resistance: 0.1 ohm

Low ON resistance leads to minimal power loss and heat generation, making this FET energy efficient.

Technical Specifications

Power Field Effect Transistors (FET) NTP18N06L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP18N06L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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