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NTP18N06

Onsemi

NTP18N06 by Onsemi

NTP18N06 by Onsemi is a Power FET with 60V DS Breakdown Voltage, 45A IDM, and 0.09 ohm RDS(on). Ideal for switching applications, it features an N-CHANNEL configuration with built-in diode in a RECTANGULAR package. Operating in enhancement mode at up to 175 °C, this MOSFET has a max power dissipation of 48.4W.

Median Price

$33.340

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 24 parts In-Stock

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Vyrian

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Digiode

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GSS - Global Semi Support

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Prism Electronics

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Fibra_Brandt Electronic GMBH

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AZTECH Wire

Italy . 576 parts In-Stock

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Corohmni

South Africa . 193 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

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A-Z Elektronik GmbH

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SupplyDigital Components

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Problanco Electronics

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UHIMA Technologies

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Perfect Parts

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Corphita

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Kulean Microsystems

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Overview

Boost your power electronics projects with the NTP18N06 by Onsemi. As a leader in semiconductor manufacturing, Onsemi ensures top-notch quality and reliability. This N-channel Power FET is perfect for switching applications, offering a high pulsing drain current of 45A and a low on-resistance of 0.09 ohms. With a maximum breakdown voltage of 60V and an avalanche energy rating of 61mJ, this transistor is built to handle demanding tasks. Upgrade your design with the NTP18N06 and experience enhanced performance and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the product long-lasting.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the desired direction, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with built-in diode for easy integration into circuits, reducing the need for additional components.

Transistor Application: SWITCHING

Ideal for switching applications, offering fast response times and reliable performance.

Minimum DS Breakdown Voltage: 60 V

Withstands high voltage levels, ensuring safe operation in various electrical systems.

Terminal Form: THROUGH-HOLE

Facilitates easy installation and secure connection within circuit boards.

Maximum Pulsed Drain Current (IDM): 45 A

Capable of handling high current loads during pulse operations, suitable for demanding applications.

Avalanche Energy Rating (EAS): 61 mJ

Provides protection against avalanche breakdown, enhancing reliability in overvoltage situations.

Maximum Drain Current (Abs) (ID): 15 A

Sufficient current capacity for various power requirements, ensuring stable performance.

Maximum Power Dissipation (Abs): 48.4 W

Efficiently dissipates heat generated during operation, preventing overheating and maximizing performance.

Maximum Operating Temperature: 175 °C

Can withstand high operating temperatures, suitable for a wide range of environmental conditions.

Maximum Drain-Source On Resistance: 0.09 ohm

Low on-resistance results in minimal power loss and improved efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NTP18N06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP18N06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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