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NTP165N65S3H

Onsemi

NTP165N65S3H by Onsemi

NTP165N65S3H by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, 53A IDM, and 0.165 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 142W power dissipation. With a temperature range of -55 to 150 °C, it's suitable for various industrial uses.

Median Price

$4.718

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Arrow

USA . 290 parts In-Stock

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$1.511

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-

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290

$1.511

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Newark

USA . 95 parts In-Stock

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$4.590

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$2.590

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$2.130

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95

$4.590

$2.590

$2.130

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Farnell

UK . 527 parts In-Stock

1+ parts

$4.845

100+ parts

$2.935

1k+ parts

$2.112

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527

$4.845

$2.935

$2.112

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Mouser Electronics

USA . 1,460 parts In-Stock

1+ parts

$5.310

100+ parts

$2.530

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$2.310

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1,460

$5.310

$2.530

$2.310

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DigiKey

USA . 732 parts In-Stock

1+ parts

$5.330

100+ parts

$2.537

1k+ parts

$1.993

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732

$5.330

$2.537

$1.993

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Element14

Singapore . 527 parts In-Stock

1+ parts

$5.441

100+ parts

$3.730

1k+ parts

$2.654

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527

$5.441

$3.730

$2.654

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Chip1Stop

Japan . 100 parts In-Stock

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$14.900

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$6.120

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$14.900

$6.120

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Verical

USA . 967 parts In-Stock

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$2.225

10k+ parts

$2.087

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$2.225

$2.087

Rochester

USA . 967 parts In-Stock

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$1.990

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$1.780

10k+ parts

$1.670

967

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$1.990

$1.780

$1.670

RS (Exports)

UK . 772 parts In-Stock

1+ parts

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100+ parts

$3.877

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$3.491

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772

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$3.877

$3.491

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Distributors (In-Stock)

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Digiode

USA . 834 parts In-Stock

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$1.435

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834

$1.435

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Vyrian

USA . 198 parts In-Stock

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$1.511

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198

$1.511

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TME

Poland . 81 parts In-Stock

1+ parts

$3.760

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$3.080

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81

$3.760

$3.080

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Flip Electronics

USA . 58,800 parts In-Stock

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58,800

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Chip Stock

USA . 3,972 parts In-Stock

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Cyclops Electronics Ltd

UK . 756 parts In-Stock

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756

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NAC Semi

USA . 300 parts In-Stock

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$9.900

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$9.140

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300

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$9.900

$9.140

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Distributors (Availability)

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Corphita

USA . 297 parts In-Stock

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$1.360

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297

$1.360

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Corohmni

South Africa . 164 parts In-Stock

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$1.511

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164

$1.511

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Continental Prestige Electronics

USA . 527 parts In-Stock

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$2.980

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$1.880

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$1.480

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527

$2.980

$1.880

$1.480

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QUARKTWIN TECHNOLOGY LTD

USA . 12,466 parts In-Stock

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Microchip USA

USA . 5,527 parts In-Stock

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TANS Electronics

Latvia . 5,089 parts In-Stock

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Problanco Electronics

Mexico . 4,934 parts In-Stock

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RC Electronics

USA . 3,200 parts In-Stock

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SupplyDigital Components

Austria . 1,468 parts In-Stock

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Kulean Microsystems

USA . 631 parts In-Stock

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Perfect Parts

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Eastek

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GreenTree Electronics

Israel . 200 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 47 parts In-Stock

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Overview

Unleash the power of the NTP165N65S3H by Onsemi, a top-tier manufacturer known for its superior quality and innovation in the realm of Power Field Effect Transistors (FET). This N-CHANNEL transistor with a single configuration and built-in diode is perfect for switching applications, offering a high DS Breakdown Voltage of 650V and a maximum pulsed drain current of 53A. With a matte tin finish and maximum operating temperature of 150°C, this FET guarantees reliable performance even in the most demanding conditions. Trust Onsemi to deliver cutting-edge technology that brings value, efficiency, and reliability to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term reliability in various operating environments.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows for safe and efficient operation in high voltage applications.

Maximum Pulsed Drain Current (IDM): 53 A

Capable of handling high peak currents, making it suitable for demanding switching applications.

Maximum Power Dissipation (Abs): 142 W

With a high power dissipation rating, this transistor can effectively handle heat and maintain performance under heavy load conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP165N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

163 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

53 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP165N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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