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NTP13N10

Onsemi

NTP13N10 by Onsemi

NTP13N10 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 100V DS Breakdown Voltage, 39A IDM, and 0.165 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with a max power dissipation of 54W.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,160 parts In-Stock

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Digiode

USA . 116 parts In-Stock

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AZTECH Wire

Italy . 138 parts In-Stock

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$13.660

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,361 parts In-Stock

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TANS Electronics

Latvia . 6,621 parts In-Stock

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SupplyDigital Components

Austria . 4,953 parts In-Stock

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Problanco Electronics

Mexico . 4,866 parts In-Stock

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Kulean Microsystems

USA . 4,322 parts In-Stock

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UHIMA Technologies

Türkiye . 662 parts In-Stock

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Corphita

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Enhance your electronic projects with the NTP13N10 Power Field Effect Transistor from Onsemi. Designed for switching applications, this N-channel transistor offers reliable performance and efficiency. With a high breakdown voltage of 100V, it can handle demanding tasks with ease. The single configuration with a built-in diode simplifies circuit design, while the metal-oxide semiconductor technology ensures optimal operation. Whether you're a hobbyist or a professional, the NTP13N10 provides value, versatility, and reliability for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the FET reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher efficiency, making them suitable for various switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in controlling power flow.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage allows the FET to handle higher voltages without malfunctioning, ensuring safety and reliability in operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over switching operations and have lower power consumption, making them efficient and reliable for various applications.

Maximum Pulsed Drain Current (IDM): 39 A

High pulsed drain current rating allows the FET to handle peak current demands, making it suitable for applications with intermittent high-power requirements.

Max Power Dissipation (Abs): 54 W

With a high power dissipation rating, this FET can handle heat generated during operation, ensuring reliability under heavy load conditions.

Maximum Drain-Source On Resistance: 0.165 ohm

Low ON resistance minimizes power losses and improves efficiency in power switching applications, making this FET a cost-effective choice.

Technical Specifications

Power Field Effect Transistors (FET) NTP13N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

85 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

39 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP13N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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