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NTP10N60

Onsemi

NTP10N60 by Onsemi

NTP10N60 by Onsemi is a Power FET with 600V DS Breakdown Voltage, 35A IDM, and 0.75 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with SILICON transistor element material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,384 parts In-Stock

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Vyrian

USA . 641 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,341 parts In-Stock

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Problanco Electronics

Mexico . 3,245 parts In-Stock

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SupplyDigital Components

Austria . 2,850 parts In-Stock

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Corphita

USA . 2,117 parts In-Stock

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TANS Electronics

Latvia . 2,017 parts In-Stock

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Kulean Microsystems

USA . 1,039 parts In-Stock

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UHIMA Technologies

Türkiye . 787 parts In-Stock

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Corohmni

South Africa . 335 parts In-Stock

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Overview

Power up your projects with the NTP10N60 by Onsemi, a top-quality Power FET that delivers unbeatable performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is perfect for various switching applications. With a maximum drain current of 10A and a minimum DS breakdown voltage of 600V, this transistor offers superior efficiency and power handling capabilities. Say goodbye to overheating issues with its low on-resistance of 0.75 ohm, ensuring optimal performance even in demanding environments. Upgrade your designs with the NTP10N60 and experience the difference in power and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the transistor, making it easier to handle and install.

Minimum DS Breakdown Voltage: 600 V

With a high minimum breakdown voltage of 600V, this power FET can be used in high voltage applications with a lower risk of failure due to voltage spikes.

Maximum Pulsed Drain Current (IDM): 35 A

The high maximum pulsed drain current of 35A allows this FET to handle high current demands during peak operation, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 201 W

With a maximum power dissipation of 201W, this FET can efficiently handle high power levels without overheating or failing, ensuring reliability in demanding environments.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures that this FET can operate reliably in elevated temperature conditions without compromising performance.

Maximum Drain-Source On Resistance: 0.75 ohm

The low maximum drain-source on resistance of 0.75 ohm results in lower power dissipation and improved efficiency during operation, making this FET a cost-effective choice for power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP10N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

35 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP10N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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