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NTNS3A65PZT5G

Onsemi

NTNS3A65PZT5G by Onsemi

NTNS3A65PZT5G by Onsemi is a P-CHANNEL FET with max drain current of 0.281A and power dissipation of 0.218W. Ideal for applications requiring high temperature resistance up to 150°C, such as in surface mount configurations for electronic devices.

Median Price

$0.098

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 311,606 parts In-Stock

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-

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$0.244

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$0.110

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311,606

-

$0.244

$0.110

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Rochester

USA . 268,106 parts In-Stock

1+ parts

-

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$0.085

1k+ parts

$0.070

10k+ parts

$0.063

268,106

-

$0.085

$0.070

$0.063

DigiKey

USA . 268,106 parts In-Stock

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-

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$0.110

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$0.110

Verical

USA . 206,928 parts In-Stock

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$0.079

206,928

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$0.079

Distributors (In-Stock)

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Digiode

USA . 1,936 parts In-Stock

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$0.069

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1,936

$0.069

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Nova Conductors

Japan . 300 parts In-Stock

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$0.085

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300

$0.085

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Chip Stock

USA . 67,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 21,999 parts In-Stock

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21,999

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Vyrian

USA . 6,471 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 273,156 parts In-Stock

1+ parts

$0.062

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273,156

$0.062

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Corphita

USA . 1,429 parts In-Stock

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$0.066

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1,429

$0.066

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Corohmni

South Africa . 203 parts In-Stock

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$0.073

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203

$0.073

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Argo Parts USA

USA . 3,980 parts In-Stock

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$0.085

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$0.082

3,980

$0.085

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$0.082

Aztec Data Supply Inc.

USA . 2,641 parts In-Stock

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$1.950

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2,641

$1.950

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AZTECH Wire

Italy . 211 parts In-Stock

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$20.930

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Continental Prestige Electronics

USA . 315,809 parts In-Stock

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$0.192

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Kepictronics

USA . 64,050 parts In-Stock

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RC Electronics

USA . 60,000 parts In-Stock

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Perfect Parts

USA . 25,480 parts In-Stock

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ChipstoGo Electronic ltd

UK . 24,000 parts In-Stock

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Lixinc

USA . 7,872 parts In-Stock

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GreenTree Electronics

Israel . 5,455 parts In-Stock

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SupplyDigital Components

Austria . 4,996 parts In-Stock

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Kulean Microsystems

USA . 4,736 parts In-Stock

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Problanco Electronics

Mexico . 4,538 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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TANS Electronics

Latvia . 2,272 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Bastille Electronics

Australia . 75 parts In-Stock

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Overview

Unleash the power of innovation with the NTNS3A65PZT5G by Onsemi, a top-tier manufacturer known for its superior quality and cutting-edge technology. As a P-CHANNEL Small Signal Field Effect Transistor, this product offers unmatched performance and reliability for various applications. With its single configuration and surface mount feature, this transistor is easy to install and delivers exceptional results. Experience the benefits of Onsemi's expertise in semiconductor technology with the NTNS3A65PZT5G, providing customers with value, efficiency, and precision in every use.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs are known for their low on-resistance and high input impedance, making them suitable for use in high-side switching applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and ensures easy integration into various electronic systems.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Drain Current (Abs) (ID): 0.281 A

The high maximum drain current capability allows the FET to handle larger loads, making it suitable for various applications.

Maximum Power Dissipation (Abs): 0.218 W

With a low power dissipation value, this FET helps in improving overall efficiency and reducing heat generation in the circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs are known for their high switching speed and low on-state resistance, making them ideal for high-frequency applications.

Maximum Operating Temperature: 150 °C

The FET can operate efficiently at high temperatures, ensuring stable performance in demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand peak reflow temperatures for a specified duration, making it suitable for reflow soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the FET can withstand the soldering process without any performance degradation.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTNS3A65PZT5G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.281 A

Maximum Drain Current (ID):

.281 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTNS3A65PZT5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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