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NTNS5K0P021ZTCG

Onsemi

NTNS5K0P021ZTCG by Onsemi

NTNS5K0P021ZTCG by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and RESISTOR, operating in ENHANCEMENT MODE. With a max power dissipation of 0.125W and temperature range from -55 to 150 °C, it offers reliable performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,121 parts In-Stock

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Digiode

USA . 2,042 parts In-Stock

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AZTECH Wire

Italy . 502 parts In-Stock

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$16.540

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502

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Kulean Microsystems

USA . 7,663 parts In-Stock

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SupplyDigital Components

Austria . 4,458 parts In-Stock

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Problanco Electronics

Mexico . 4,279 parts In-Stock

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Corphita

USA . 2,032 parts In-Stock

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TANS Electronics

Latvia . 813 parts In-Stock

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Corohmni

South Africa . 339 parts In-Stock

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UHIMA Technologies

Türkiye . 195 parts In-Stock

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Overview

Discover the NTNS5K0P021ZTCG by Onsemi, a high-quality P-Channel small signal Field Effect Transistor with a built-in diode and resistor for efficient switching applications. Manufactured by Onsemi, known for their reliability and innovation, this FET offers customers exceptional value with its enhanced mode operation, low power dissipation, and wide operating temperature range. Perfect for various electronic projects, this surface-mount transistor is a versatile choice for design engineers looking for performance and durability in a compact package. Unlock your potential with the NTNS5K0P021ZTCG and experience the difference Onsemi can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where a P-channel FET is preferred.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies circuit design by including a diode and resistor in the package.

Transistor Application: SWITCHING

Designed for efficient switching applications.

Surface Mount: YES

Easy to mount on a PCB for compact and space-saving designs.

Maximum Power Dissipation: 0.125 W

Efficient power handling capability for its size.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTNS5K0P021ZTCG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.127 A

Maximum Drain-Source On Resistance:

5.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTNS5K0P021ZTCG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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