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NTNS3190NZT5G

Onsemi

NTNS3190NZT5G by Onsemi

NTNS3190NZT5G by Onsemi is a N-CHANNEL FET with built-in diode and resistor, ideal for switching applications. It features a 20V DS breakdown voltage, 0.23A max drain current, and 1.4 ohm max on resistance. This chip carrier package has no lead terminals and operates in enhancement mode at temperatures as low as -55°C.

Median Price

$0.249

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,224 parts In-Stock

1+ parts

$0.690

100+ parts

$0.318

1k+ parts

$0.229

10k+ parts

$0.210

3,224

$0.690

$0.318

$0.229

$0.210

Rochester

USA . 6,556,725 parts In-Stock

1+ parts

-

100+ parts

$0.249

1k+ parts

$0.207

10k+ parts

$0.184

6,556,725

-

$0.249

$0.207

$0.184

Verical

USA . 6,150,500 parts In-Stock

1+ parts

-

100+ parts

-

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$0.230

6,150,500

-

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$0.230

Flip Electronics (Authorized)

USA . 124,000 parts In-Stock

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-

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124,000

-

-

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Element14

Singapore . 7,865 parts In-Stock

1+ parts

-

100+ parts

$0.612

1k+ parts

$0.372

10k+ parts

$0.323

7,865

-

$0.612

$0.372

$0.323

Farnell

UK . 6,363 parts In-Stock

1+ parts

-

100+ parts

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$0.105

6,363

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$0.105

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,409 parts In-Stock

1+ parts

$0.194

100+ parts

-

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1,409

$0.194

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.252

100+ parts

-

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100

$0.252

-

-

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Maritex

Poland . 52,000 parts In-Stock

1+ parts

$0.473

100+ parts

-

1k+ parts

-

10k+ parts

$0.126

52,000

$0.473

-

-

$0.126

Vyrian

USA . 2,573,421 parts In-Stock

1+ parts

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2,573,421

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Flip Electronics

USA . 92,000 parts In-Stock

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Chip Stock

USA . 66,900 parts In-Stock

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SPM Sales

USA . 14,985 parts In-Stock

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14,985

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PC Components Company LLC

USA . 5,000 parts In-Stock

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5,000

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Bristol Electronics

USA . 5,000 parts In-Stock

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5,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,573,221 parts In-Stock

1+ parts

$0.173

100+ parts

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2,573,221

$0.173

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Corphita

USA . 1,878 parts In-Stock

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$0.184

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1,878

$0.184

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Corohmni

South Africa . 246 parts In-Stock

1+ parts

$0.204

100+ parts

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246

$0.204

-

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$0.252

100+ parts

$0.239

1k+ parts

$0.227

10k+ parts

$0.224

50

$0.252

$0.239

$0.227

$0.224

RC Electronics

USA . 54,000 parts In-Stock

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54,000

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Lixinc

USA . 8,723 parts In-Stock

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8,723

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Continental Prestige Electronics

USA . 7,865 parts In-Stock

1+ parts

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100+ parts

$0.275

1k+ parts

$0.143

10k+ parts

$0.140

7,865

-

$0.275

$0.143

$0.140

A-Z Elektronik GmbH

Germany . 6,360 parts In-Stock

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6,360

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SupplyDigital Components

Austria . 5,068 parts In-Stock

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5,068

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Kulean Microsystems

USA . 4,192 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 882 parts In-Stock

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882

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Problanco Electronics

Mexico . 359 parts In-Stock

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359

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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288

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Overview

Elevate your electronic designs with the NTNS3190NZT5G by Onsemi, a high-quality Small Signal Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a renowned industry leader, this N-CHANNEL transistor is perfect for switching applications. With a built-in diode and resistor, this transistor provides added convenience and efficiency. Whether you're working on consumer electronics or automotive systems, this surface mount transistor delivers unmatched value and benefits. Trust Onsemi's expertise and elevate your projects with the NTNS3190NZT5G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher mobility and conductivity, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and reduce external component requirements, saving space and overall cost.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast switching speeds and low power consumption.

Surface Mount: YES

The surface mount capability enables easy PCB integration and automated assembly processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle moderate voltage levels reliably.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good insulation and high electrical performance, ensuring stability in operation.

Maximum Drain Current (ID): 0.23 A

Capable of handling a maximum drain current of 0.23A, making it suitable for low to medium power applications.

Maximum Drain-Source On Resistance: 1.4 ohm

The low drain-source resistance of 1.4 ohms results in efficient power transfer and minimal conduction losses.

Maximum Time At Peak Reflow Temperature (s): 30

The transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTNS3190NZT5G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.23 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PBCC-N3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTNS3190NZT5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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