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NTNS3C94NZT5G

Onsemi

NTNS3C94NZT5G by Onsemi

NTNS3C94NZT5G by Onsemi is a N-CHANNEL FET with 12V DS Breakdown Voltage, 0.384A ID, and 0.48ohm RDS. It's used for SWITCHING applications in ENHANCEMENT MODE at -55 to 150 °C, featuring PLASTIC/EPOXY package and NO LEAD terminals.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,192 parts In-Stock

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Digiode

USA . 1,215 parts In-Stock

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AZTECH Wire

Italy . 563 parts In-Stock

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$12.720

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Component Stockers USA

USA . 346 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 5,230 parts In-Stock

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Kulean Microsystems

USA . 5,171 parts In-Stock

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Problanco Electronics

Mexico . 4,407 parts In-Stock

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Corphita

USA . 2,168 parts In-Stock

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SupplyDigital Components

Austria . 2,159 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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UHIMA Technologies

Türkiye . 124 parts In-Stock

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Overview

Unleash the power of innovation with the NTNS3C94NZT5G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Small Signal Field Effect Transistors (FET) perfect for switching applications. With a single configuration and built-in diode and resistor, this N-CHANNEL transistor offers unparalleled reliability and performance. Say goodbye to limitations and embrace endless possibilities with the NTNS3C94NZT5G. Experience enhanced efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically offer higher mobility and faster switching speeds compared to P-Channel types, making this transistor ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and reduce component count, saving space and cost in the overall system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can efficiently control the flow of current in electronic circuits, making it ideal for power management and control.

Surface Mount: YES

The surface mount design allows for easy and secure attachment to circuit boards, saving assembly time and enabling high-density PCB layouts.

Minimum DS Breakdown Voltage: 12 V

With a minimum breakdown voltage of 12V, this transistor can handle a wide range of voltages, providing flexibility in circuit design.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent corrosion resistance and ensures reliable electrical connections, enhancing the overall performance and lifespan of the transistor.

Maximum Drain Current (ID): 0.384 A

With a high maximum drain current rating of 0.384A, this transistor can handle higher power loads, making it suitable for a variety of applications that require high current handling capabilities.

Maximum Drain-Source On Resistance: 0.48 ohm

The low on-resistance of 0.48 ohms minimizes power loss and heat generation in the transistor, resulting in higher efficiency and improved reliability.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTNS3C94NZT5G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

.384 A

Maximum Drain-Source On Resistance:

.48 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PBCC-N3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTNS3C94NZT5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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