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NTNS3A91PZT5G

Onsemi

NTNS3A91PZT5G by Onsemi

NTNS3A91PZT5G by Onsemi is a P-CHANNEL FET with max drain current of 0.223A and power dissipation of 0.121W. Ideal for applications requiring small signal amplification in surface mount configurations at temperatures up to 150°C.

Median Price

$0.294

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 66,496 parts In-Stock

1+ parts

$0.601

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66,496

$0.601

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DigiKey

USA . 359,840 parts In-Stock

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$0.260

359,840

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$0.260

Rochester

USA . 358,084 parts In-Stock

1+ parts

-

100+ parts

$0.305

1k+ parts

$0.253

10k+ parts

$0.226

358,084

-

$0.305

$0.253

$0.226

Verical

USA . 206,230 parts In-Stock

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$0.282

206,230

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$0.282

Flip Electronics (Authorized)

USA . 128,000 parts In-Stock

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128,000

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Digiode

USA . 2,085 parts In-Stock

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$0.238

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2,085

$0.238

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Vyrian

USA . 306 parts In-Stock

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$0.250

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306

$0.250

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Nova Conductors

Japan . 70 parts In-Stock

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$0.822

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70

$0.822

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Flip Electronics

USA . 154,886 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 246,396 parts In-Stock

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$0.212

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246,396

$0.212

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Corphita

USA . 1,273 parts In-Stock

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$0.225

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Corohmni

South Africa . 196 parts In-Stock

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$0.250

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196

$0.250

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Modulus Dynamics

Lithuania . 19,346 parts In-Stock

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$1.599

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$1.599

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$1.599

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19,346

$1.599

$1.599

$1.599

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Continental Prestige Electronics

USA . 352,961 parts In-Stock

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$0.550

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352,961

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$0.550

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Kepictronics

USA . 65,850 parts In-Stock

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65,850

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Perfect Parts

USA . 17,920 parts In-Stock

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Problanco Electronics

Mexico . 6,227 parts In-Stock

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SupplyDigital Components

Austria . 6,107 parts In-Stock

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TANS Electronics

Latvia . 5,157 parts In-Stock

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Kulean Microsystems

USA . 4,271 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 556 parts In-Stock

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UHIMA Technologies

Türkiye . 92 parts In-Stock

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Overview

Elevate your electronic designs with the NTNS3A91PZT5G by Onsemi, a top-tier manufacturer known for quality and innovation. As part of the Small Signal Field Effect Transistors category, this P-CHANNEL FET offers unparalleled reliability and performance in a compact, surface mount configuration. With a maximum operating temperature of 150°C and a maximum drain current of 0.223 A, this transistor is ideal for a wide range of applications. Experience the value and benefits of Onsemi's advanced METAL-OXIDE SEMICONDUCTOR technology, providing customers with superior efficiency and lasting durability.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL transistors are known for their low on-resistance, making them suitable for high power applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration on circuit boards, saving space and facilitating automated assembly.

Maximum Drain Current (Abs): 0.223 A

The high maximum drain current rating allows for handling higher power levels, making this transistor suitable for various applications.

Maximum Power Dissipation (Abs): 0.121 W

With a high maximum power dissipation capability, this transistor can operate at higher power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs provide reliable performance and are commonly used in integrated circuits for their low power consumption.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature tolerance ensures the transistor can withstand elevated temperatures, improving overall reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent corrosion resistance and ensures good electrical conductivity for reliable connections.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature allows for efficient soldering processes and prevents excessive heat exposure to the transistor.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables reliable soldering processes without damaging the transistor, ensuring robust solder joints.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTNS3A91PZT5G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.223 A

Maximum Drain Current (ID):

.223 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTNS3A91PZT5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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