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NTNS4C69NTCG

Onsemi

NTNS4C69NTCG by Onsemi

NTNS4C69NTCG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 0.178W Power Dissipation, and 0.155ohm Drain-Source Resistance. Ideal for SWITCHING applications, this ENHANCEMENT MODE transistor operates b/w -55 to 150 °C with a max drain current of 1A.

Median Price

$0.549

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 46,800 parts In-Stock

1+ parts

-

100+ parts

$0.549

1k+ parts

$0.455

10k+ parts

$0.406

46,800

-

$0.549

$0.455

$0.406

Verical

USA . 46,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.569

10k+ parts

$0.507

46,800

-

-

$0.569

$0.507

DigiKey

USA . 15,514 parts In-Stock

1+ parts

-

100+ parts

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$0.420

15,514

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$0.420

Flip Electronics (Authorized)

USA . 15,514 parts In-Stock

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15,514

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Distributors (In-Stock)

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Vyrian

USA . 1,220 parts In-Stock

1+ parts

$0.378

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1,220

$0.378

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Digiode

USA . 1,300 parts In-Stock

1+ parts

$0.428

100+ parts

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1,300

$0.428

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Flip Electronics

USA . 5,511 parts In-Stock

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5,511

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Bristol Electronics

USA . 4,000 parts In-Stock

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4,000

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Distributors (Availability)

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Corohmni

South Africa . 288 parts In-Stock

1+ parts

$0.378

100+ parts

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288

$0.378

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Corphita

USA . 576 parts In-Stock

1+ parts

$0.405

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576

$0.405

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Component Stockers USA

USA . 38,981 parts In-Stock

1+ parts

$0.460

100+ parts

$0.430

1k+ parts

$0.390

10k+ parts

$0.390

38,981

$0.460

$0.430

$0.390

$0.390

Continental Prestige Electronics

USA . 48,000 parts In-Stock

1+ parts

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100+ parts

$0.540

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48,000

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$0.540

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SupplyDigital Components

Austria . 8,099 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,609 parts In-Stock

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5,609

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Problanco Electronics

Mexico . 1,384 parts In-Stock

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1,384

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TANS Electronics

Latvia . 357 parts In-Stock

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UHIMA Technologies

Türkiye . 213 parts In-Stock

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Kulean Microsystems

USA . 193 parts In-Stock

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193

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Overview

Enhance your electronic projects with the high-quality NTNS4C69NTCG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers reliable Small Signal Field Effect Transistors (FET) for a variety of applications such as switching. With its N-CHANNEL polarity and built-in diode configuration, this transistor offers exceptional performance and efficiency. Say goodbye to technical headaches and hello to seamless operation with this surface-mount transistor that boasts a maximum drain current of 1A and a minimum operating temperature of -55 °C. Trust Onsemi to provide you with the best in semiconductor technology for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching applications and enables control of current flow through the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a built-in diode, reducing the need for additional components.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

Can handle higher voltages, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 1 A

Capable of handling high current loads, suitable for various power applications.

Maximum Drain-Source On Resistance: 0.155 ohm

Low on-resistance ensures minimal power loss and efficient switching performance.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold environments, providing versatility in usage.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTNS4C69NTCG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

.155 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PBCC-N3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTNS4C69NTCG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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