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NTNS41S006PZTCG

Onsemi

NTNS41S006PZTCG by Onsemi

NTNS41S006PZTCG by Onsemi is a P-CHANNEL FET for SWITCHING applications. It features a 30V DS Breakdown Voltage, 4 ohm Drain-Source Resistance, and 0.137A Drain Current. With a temperature range of -55 to 150 °C, this MOSFET is ideal for various electronic devices requiring efficient power management.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 280,000 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

280,000

-

$0.119

$0.099

$0.088

DigiKey

USA . 280,000 parts In-Stock

1+ parts

-

100+ parts

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$0.150

280,000

-

-

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$0.150

Verical

USA . 280,000 parts In-Stock

1+ parts

-

100+ parts

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$0.110

280,000

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-

-

$0.110

Distributors (In-Stock)

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Digiode

USA . 2,092 parts In-Stock

1+ parts

$0.093

100+ parts

-

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2,092

$0.093

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Vyrian

USA . 2,082 parts In-Stock

1+ parts

$0.098

100+ parts

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2,082

$0.098

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DigiKey Marketplace

USA . 280,000 parts In-Stock

1+ parts

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100+ parts

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$0.100

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-

280,000

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-

$0.100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,257 parts In-Stock

1+ parts

$0.088

100+ parts

-

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2,257

$0.088

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Corohmni

South Africa . 430 parts In-Stock

1+ parts

$0.098

100+ parts

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430

$0.098

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Continental Prestige Electronics

USA . 280,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.117

10k+ parts

-

280,000

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$0.117

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QUARKTWIN TECHNOLOGY LTD

USA . 14,521 parts In-Stock

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14,521

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TANS Electronics

Latvia . 5,010 parts In-Stock

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5,010

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SupplyDigital Components

Austria . 4,446 parts In-Stock

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4,446

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Problanco Electronics

Mexico . 4,439 parts In-Stock

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4,439

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Kulean Microsystems

USA . 4,113 parts In-Stock

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4,113

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UHIMA Technologies

Türkiye . 550 parts In-Stock

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550

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Overview

Unleash the power of cutting-edge technology with the NTNS41S006PZTCG by Onsemi. Crafted with precision and expertise, this Small Signal Field Effect Transistor offers unparalleled performance in switching applications. With a single design featuring a built-in diode and resistor, this P-Channel transistor is the epitome of efficiency. Experience seamless operation and enhanced functionality with its nickel palladium gold terminal finish and metal-oxide semiconductor technology. Elevate your projects to new heights with the NTNS41S006PZTCG - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are suitable for switching applications and can offer high performance in certain circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design, potentially reducing the need for additional components and saving space.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient operation and reliable performance in such scenarios.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30 V, this transistor can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape can facilitate easier placement and handling during assembly and installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control over the transistor's switching behavior, providing versatility in different circuit configurations.

No. of Terminals: 3

The 3 terminals offer connectivity options for various circuit configurations, providing flexibility in design and functionality.

Maximum Power Dissipation (Abs): 0.121 W

The low power dissipation rating indicates high efficiency and reliability, making the transistor suitable for energy-efficient applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging offers a compact and protective housing for the transistor, ideal for space-constrained electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides enhanced performance and reliability, ensuring stable operation in a variety of conditions.

Maximum Operating Temperature: 150 °C

With a high operating temperature range of 150 °C, this transistor can withstand elevated temperatures, suitable for demanding environments.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making them a popular choice for a wide range of electronic applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature of -55 °C, this transistor can function effectively in cold environments or during temperature fluctuations.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides corrosion resistance and ensures reliable electrical connections, enhancing the overall durability of the transistor.

Maximum Drain Current (ID): 0.137 A

The high maximum drain current rating allows for efficient power handling and operation, making the transistor suitable for high-performance applications.

Maximum Drain-Source On Resistance: 4 ohm

With a low drain-source on resistance of 4 ohms, this transistor can minimize power loss and improve efficiency in switching applications.

Terminal Position: BOTTOM

The bottom terminal position can facilitate easy and secure connections, ensuring stable performance in various circuit layouts.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and can enhance overall performance and reliability of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTNS41S006PZTCG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.137 A

Maximum Drain-Source On Resistance:

4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PBCC-N3

JESD-609 Code:

e4

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTNS41S006PZTCG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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