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BSS83PL6327

Infineon Technologies

BSS83PL6327 by Infineon Technologies

BSS83PL6327 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, 0.33A ID, and 2 ohm RDS(on). Ideal for small signal applications in electronics due to its compact size, ENHANCEMENT MODE operation, and low feedback capacitance of 9pF. Suitable for surface mount designs with GULL WING terminals.

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9

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1k+

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Chip Stock

USA . 30,500 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 6,639 parts In-Stock

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Pegasus Components GmbH

Germany . 5,351 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,645 parts In-Stock

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ComSIT USA

USA . 3,645 parts In-Stock

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VNN

France . 1,859 parts In-Stock

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Vyrian

USA . 1,260 parts In-Stock

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Digiode

USA . 649 parts In-Stock

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649

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Nova Conductors

Japan . 10 parts In-Stock

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Modulus Dynamics

Lithuania . 25,885 parts In-Stock

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$1.107

100+ parts

$1.063

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$1.018

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25,885

$1.107

$1.063

$1.018

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Corohmni

South Africa . 1,128 parts In-Stock

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$1.298

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$1.298

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Aztec Data Supply Inc.

USA . 4,977 parts In-Stock

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$1.370

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4,977

$1.370

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$2.055

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$1.952

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$1.952

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15

$2.055

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$1.952

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Ampacity Inc.

Singapore . 170 parts In-Stock

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$12.050

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170

$12.050

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Andel Nordic

Denmark . 5,159 parts In-Stock

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$15.980

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$11.187

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$11.187

5,159

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$11.187

AZTECH Wire

Italy . 734 parts In-Stock

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$16.842

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734

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Decca Corp

Germany . 1,504 parts In-Stock

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$32.050

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$31.409

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$31.095

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$32.050

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Semicontronic

India . 892 parts In-Stock

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$36.050

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$35.149

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$34.968

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892

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RC Electronics

USA . 24,300 parts In-Stock

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$0.040

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Perfect Parts

USA . 6,254 parts In-Stock

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Continental Prestige Electronics

USA . 4,825 parts In-Stock

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Authorized Procurement Solutions

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Cyclops Electronics Ltd (Excess)

UK . 2,792 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

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Spain . 600 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$3.975

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$3.975

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Lucentia Tech

USA . 500 parts In-Stock

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$3.975

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$3.975

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Argo Parts USA

USA . 92 parts In-Stock

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Overview

Experience superior performance and reliability with the BSS83PL6327 Small Signal Field Effect Transistor by Infineon Technologies. This P-Channel transistor offers a built-in diode in a compact rectangular package, making it ideal for a wide range of applications. With a maximum drain current of 0.33 A and a low on-resistance of 2 ohms, this transistor ensures efficient operation. Trust in Infineon's cutting-edge technology and quality materials to deliver exceptional results for your electronic projects. Elevate your designs with the BSS83PL6327 and enjoy the benefits of enhanced performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable package for the transistor, making it suitable for a wide range of applications.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for efficient current flow and is ideal for low power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB.

Surface Mount: YES

The surface mount capability makes installation quick and easy, especially in compact electronic devices.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can handle higher voltages without malfunctioning.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB.

Terminal Form: GULL WING

The gull wing terminals make soldering and connection secure and reliable.

Operating Mode: ENHANCEMENT MODE

This mode offers fast switching speed and lower power consumption, making it energy-efficient.

No. of Terminals: 3

With three terminals, this transistor offers flexibility in circuit design and connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for dense packing on the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high performance and reliability in a variety of applications.

Maximum Operating Temperature: 150 °C

This transistor can operate at high temperatures without sacrificing performance, making it suitable for demanding environments.

Transistor Element Material: SILICON

Silicon is a common material known for its stability and reliability in electronic components.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and ensures a secure connection.

Maximum Drain Current (ID): 0.33 A

This high drain current rating allows the transistor to handle heavier loads without overheating.

Maximum Drain-Source On Resistance: 2 ohm

The low on-resistance reduces power loss and improves efficiency in the circuit.

Terminal Position: DUAL

With dual terminal positions, this transistor offers versatility in circuit layout and design.

Maximum Time At Peak Reflow Temperature (s): 40

The transistor can withstand peak reflow temperatures for a specified amount of time, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for quick and efficient soldering during assembly.

Maximum Feedback Capacitance (Crss): 9 pF

The low feedback capacitance minimizes signal distortion and improves overall performance of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS83PL6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.33 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

9 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

BSS83PL6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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