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NTMYS029N08LHTWG

Onsemi

NTMYS029N08LHTWG by Onsemi

The Onsemi NTMYS029N08LHTWG is a N-CHANNEL Power FET with 80V DS Breakdown Voltage and 97A IDM. Ideal for applications requiring high power dissipation, such as automotive electronics and industrial control systems. Features include a built-in diode, small outline package style, and -55 to 175 °C operating temperature range.

Median Price

$1.019

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,669 parts In-Stock

1+ parts

$2.680

100+ parts

$1.750

1k+ parts

$1.290

10k+ parts

$0.842

2,669

$2.680

$1.750

$1.290

$0.842

DigiKey

USA . 15,000 parts In-Stock

1+ parts

-

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$0.840

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15,000

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$0.840

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Flip Electronics (Authorized)

USA . 15,000 parts In-Stock

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15,000

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Rochester

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

$1.000

1k+ parts

$0.830

10k+ parts

$0.740

2,900

-

$1.000

$0.830

$0.740

Verical

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.038

10k+ parts

$0.925

2,900

-

-

$1.038

$0.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 950 parts In-Stock

1+ parts

$0.777

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-

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950

$0.777

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Vyrian

USA . 497 parts In-Stock

1+ parts

$0.818

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497

$0.818

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Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 522 parts In-Stock

1+ parts

$0.736

100+ parts

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522

$0.736

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Corohmni

South Africa . 194 parts In-Stock

1+ parts

$0.818

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194

$0.818

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TANS Electronics

Latvia . 4,233 parts In-Stock

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Problanco Electronics

Mexico . 4,232 parts In-Stock

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Kulean Microsystems

USA . 2,970 parts In-Stock

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2,970

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UHIMA Technologies

Türkiye . 979 parts In-Stock

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SupplyDigital Components

Austria . 827 parts In-Stock

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Overview

Discover the NTMYS029N08LHTWG by Onsemi, a high-quality Power Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL FET is designed for applications requiring efficient power management. With a built-in diode and an impressive maximum pulsed drain current of 97A, this transistor ensures optimal power dissipation and enhanced energy efficiency. Experience the benefits of this cutting-edge technology, from its small outline package to its matte tin terminal finish, making it ideal for a wide range of electronic devices. Elevate your designs with the NTMYS029N08LHTWG and unlock the potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher electron mobility, making them efficient for use in various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Minimum DS Breakdown Voltage: 80 V

Can handle higher voltages, suitable for power applications.

Maximum Pulsed Drain Current (IDM): 97 A

High current handling capability allows for use in power-hungry applications.

Maximum Power Dissipation (Abs): 33 W

High power dissipation capability ensures efficient heat management.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS029N08LHTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

68 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

97 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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