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NTMYS003N08LHTWG

Onsemi

NTMYS003N08LHTWG by Onsemi

NTMYS003N08LHTWG by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage, 900A IDM, and 0.0043 ohm RDS(on). Ideal for power applications requiring high current handling capabilities. Features include built-in diode, small outline package style, and operating temperature range of -55 to 175 °C.

Median Price

$3.355

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,970 parts In-Stock

1+ parts

$3.170

100+ parts

-

1k+ parts

-

10k+ parts

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2,970

$3.170

-

-

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Mouser Electronics

USA . 2,998 parts In-Stock

1+ parts

$3.540

100+ parts

$1.700

1k+ parts

$1.290

10k+ parts

$1.230

2,998

$3.540

$1.700

$1.290

$1.230

DigiKey

USA . 2,990 parts In-Stock

1+ parts

$3.860

100+ parts

$1.711

1k+ parts

$1.285

10k+ parts

$1.240

2,990

$3.860

$1.711

$1.285

$1.240

Element14

Singapore . 3,000 parts In-Stock

1+ parts

$4.120

100+ parts

$2.730

1k+ parts

$2.210

10k+ parts

$2.050

3,000

$4.120

$2.730

$2.210

$2.050

Flip Electronics (Authorized)

USA . 21,000 parts In-Stock

1+ parts

-

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21,000

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Farnell

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.210

10k+ parts

$1.160

3,000

-

$1.510

$1.210

$1.160

Rochester

USA . 71 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

71

-

$1.240

$1.110

$1.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,607 parts In-Stock

1+ parts

$1.311

100+ parts

-

1k+ parts

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10k+ parts

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1,607

$1.311

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-

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Vyrian

USA . 661 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

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661

$1.380

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Flip Electronics

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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21,000

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 377 parts In-Stock

1+ parts

$1.242

100+ parts

-

1k+ parts

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10k+ parts

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377

$1.242

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-

-

Corohmni

South Africa . 151 parts In-Stock

1+ parts

$1.380

100+ parts

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151

$1.380

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TANS Electronics

Latvia . 6,649 parts In-Stock

1+ parts

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6,649

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Problanco Electronics

Mexico . 5,655 parts In-Stock

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5,655

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Kulean Microsystems

USA . 2,420 parts In-Stock

1+ parts

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2,420

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UHIMA Technologies

Türkiye . 798 parts In-Stock

1+ parts

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798

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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SupplyDigital Components

Austria . 384 parts In-Stock

1+ parts

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384

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Overview

Discover the NTMYS003N08LHTWG by Onsemi, a top-of-the-line Power Field Effect Transistor that guarantees reliability and superior performance. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL FET with a built-in diode offers endless possibilities in various applications. With its high-quality construction and innovative design, this transistor ensures optimal functionality and efficiency. Unlock the potential of your projects with the NTMYS003N08LHTWG by Onsemi, delivering value, benefits, and advantages that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material results in a lightweight and durable package, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, enhancing the reliability and performance of the transistor in various circuits.

Surface Mount: YES

The surface-mount capability simplifies the assembly process and saves space on the PCB, making it ideal for compact electronic devices.

Maximum Pulsed Drain Current (IDM): 900 A

The high maximum pulsed drain current rating allows the transistor to handle brief surges of current without damage, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 137 W

The high power dissipation capability ensures efficient operation and reliability even under high load conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating allows the FET to withstand elevated temperatures, making it suitable for industrial and automotive applications where temperature fluctuations are common.

Maximum Drain-Source On Resistance: 0.0043 ohm

The low on-resistance results in minimal voltage drop and power loss across the transistor, improving overall efficiency in power delivery applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS003N08LHTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1211 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

132 A

Maximum Drain Current (ID):

132 A

Maximum Drain-Source On Resistance:

.0043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

19 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMYS003N08LHTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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