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NTMYS4D5N04CTWG

Onsemi

NTMYS4D5N04CTWG by Onsemi

NTMYS4D5N04CTWG by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage and 80A Drain Current. Ideal for power applications, it features a built-in diode, 55W Power Dissipation, and operates in Enhancement Mode. Suitable for surface mount designs with a small outline package style.

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$2.070

100+ parts

$0.896

1k+ parts

$0.662

10k+ parts

$0.630

3,000

$2.070

$0.896

$0.662

$0.630

DigiKey

USA . 2,990 parts In-Stock

1+ parts

$2.070

100+ parts

$0.895

1k+ parts

$0.674

10k+ parts

$0.551

2,990

$2.070

$0.895

$0.674

$0.551

Flip Electronics (Authorized)

USA . 17,600 parts In-Stock

1+ parts

-

100+ parts

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17,600

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Distributors (In-Stock)

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Digiode

USA . 1,365 parts In-Stock

1+ parts

$1.872

100+ parts

-

1k+ parts

-

10k+ parts

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1,365

$1.872

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Flip Electronics

USA . 17,600 parts In-Stock

1+ parts

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100+ parts

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17,600

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DigiKey Marketplace

USA . 17,600 parts In-Stock

1+ parts

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17,600

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Vyrian

USA . 7,371 parts In-Stock

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7,371

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

-

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,424 parts In-Stock

1+ parts

$1.670

100+ parts

-

1k+ parts

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10k+ parts

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7,424

$1.670

-

-

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Corphita

USA . 431 parts In-Stock

1+ parts

$1.773

100+ parts

-

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431

$1.773

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Corohmni

South Africa . 246 parts In-Stock

1+ parts

$1.970

100+ parts

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246

$1.970

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Microchip USA

USA . 5,980 parts In-Stock

1+ parts

$10.295

100+ parts

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5,980

$10.295

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Kulean Microsystems

USA . 5,892 parts In-Stock

1+ parts

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5,892

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Problanco Electronics

Mexico . 5,797 parts In-Stock

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5,797

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Continental Prestige Electronics

USA . 4,614 parts In-Stock

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4,614

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Argo Parts USA

USA . 1,544 parts In-Stock

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1,544

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TANS Electronics

Latvia . 1,265 parts In-Stock

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1,265

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SupplyDigital Components

Austria . 829 parts In-Stock

1+ parts

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829

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UHIMA Technologies

Türkiye . 317 parts In-Stock

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317

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Bastille Electronics

Australia . 15 parts In-Stock

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15

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Overview

Enhance your power management capabilities with the NTMYS4D5N04CTWG by Onsemi. Known for their high-quality products, Onsemi delivers top-of-the-line Power Field Effect Transistors that offer exceptional performance and reliability. Whether you're looking to optimize power efficiency in automotive, industrial, or consumer electronics applications, this N-CHANNEL FET with a built-in diode is the perfect solution. With a maximum drain current of 80A and low on-resistance, this transistor provides unparalleled value and benefits to customers seeking efficient power control. Upgrade your systems today with Onsemi's NTMYS4D5N04CTWG.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the FET, making it a reliable choice for various applications.

Polarity or Channel Type - N-CHANNEL

N-channel FETs typically offer lower ON-resistance and faster switching speeds compared to P-channel FETs, making them a suitable choice for high-performance applications.

Configuration - SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient control of the current flow, making this FET ideal for applications requiring reverse current protection or motor control.

Surface Mount - YES

Being surface mountable, this FET can be easily integrated onto PCBs, saving space and simplifying the manufacturing process.

Maximum Pulsed Drain Current (IDM) - 400 A

With a high pulsed drain current rating, this FET can handle large surge currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs) - 55 W

The high power dissipation capability of this FET allows it to handle high power levels without overheating, ensuring reliable operation.

Maximum Operating Temperature - 175 °C

The high maximum operating temperature makes this FET suitable for use in a wide range of environments, including industrial applications where temperature fluctuations are common.

Maximum Feedback Capacitance (Crss) - 25 pF

Low feedback capacitance helps reduce the risk of oscillations in high-frequency applications, making this FET a stable choice for RF and high-speed digital circuits.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS4D5N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

239 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMYS4D5N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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