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NTMYS3D3N06CLTWG

Onsemi

NTMYS3D3N06CLTWG by Onsemi

NTMYS3D3N06CLTWG by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 811A IDM. Ideal for applications requiring high power dissipation, it features a built-in diode, 0.0042 ohm RDS(on), and operates in enhancement mode. Suitable for surface mount designs in various electronic systems.

Median Price

$3.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,886 parts In-Stock

1+ parts

$3.300

100+ parts

$1.500

1k+ parts

$1.250

10k+ parts

$1.200

2,886

$3.300

$1.500

$1.250

$1.200

DigiKey

USA . 1,476 parts In-Stock

1+ parts

$3.300

100+ parts

$1.491

1k+ parts

$1.275

10k+ parts

$1.042

1,476

$3.300

$1.491

$1.275

$1.042

Rochester

USA . 19,185 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.170

10k+ parts

$1.040

19,185

-

$1.410

$1.170

$1.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,716 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

10k+ parts

-

1,716

$1.102

-

-

-

Vyrian

USA . 281 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

-

281

$1.160

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 349 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

349

$1.044

-

-

-

Corohmni

South Africa . 121 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

-

121

$1.160

-

-

-

Component Stockers USA

USA . 23,572 parts In-Stock

1+ parts

$2.900

100+ parts

$2.730

1k+ parts

$2.460

10k+ parts

$2.460

23,572

$2.900

$2.730

$2.460

$2.460

Microchip USA

USA . 4,191 parts In-Stock

1+ parts

$18.954

100+ parts

-

1k+ parts

-

10k+ parts

-

4,191

$18.954

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Problanco Electronics

Mexico . 6,269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,269

-

-

-

-

TANS Electronics

Latvia . 4,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,879

-

-

-

-

SupplyDigital Components

Austria . 1,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,974

-

-

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Kulean Microsystems

USA . 1,867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,867

-

-

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UHIMA Technologies

Türkiye . 217 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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217

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-

-

Overview

Experience superior power management with the NTMYS3D3N06CLTWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-of-the-line Power Field Effect Transistors (FET) like this N-CHANNEL transistor with a built-in diode. Ideal for various applications, this transistor offers unmatched performance and reliability. With a high breakdown voltage and low on-resistance, customers can trust that their devices will operate efficiently and effectively. Upgrade your power systems today with the NTMYS3D3N06CLTWG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current in the desired direction, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and offers added functionality with the built-in diode.

Minimum DS Breakdown Voltage: 60 V

Ensures reliable operation and protection against voltage spikes.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and simplifying assembly.

Maximum Pulsed Drain Current (IDM): 811 A

Allows for high current handling capability, suitable for demanding applications.

Maximum Power Dissipation (Abs): 100 W

Provides high power dissipation capability, allowing for sustained operation under heavy load.

Maximum Operating Temperature: 175 °C

Supports operation in wide temperature range, making it versatile for different environments.

Maximum Drain-Source On Resistance: 0.0042 ohm

Offers low on-resistance for efficient power handling and minimal losses.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS3D3N06CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

133 A

Maximum Drain Current (ID):

26 A

Maximum Drain-Source On Resistance:

.0042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

811 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMYS3D3N06CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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