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NTMYS008N08LHTWG

Onsemi

NTMYS008N08LHTWG by Onsemi

NTMYS008N08LHTWG by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage, 319A IDM, and 0.011 ohm RDS(on). It is used in power applications due to its 73W Pdiss, -55 to 175 °C operating temp range, and built-in diode configuration.

Median Price

$4.070

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 13,900 parts In-Stock

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Vyrian

USA . 306 parts In-Stock

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Flip Electronics

USA . 10,900 parts In-Stock

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Digiode

USA . 1,557 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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TANS Electronics

Latvia . 5,110 parts In-Stock

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SupplyDigital Components

Austria . 2,252 parts In-Stock

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Corphita

USA . 2,054 parts In-Stock

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Kulean Microsystems

USA . 1,878 parts In-Stock

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Problanco Electronics

Mexico . 1,078 parts In-Stock

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UHIMA Technologies

Türkiye . 183 parts In-Stock

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Overview

Experience unparalleled power and performance with the NTMYS008N08LHTWG by Onsemi. Crafted with precision and expertise, this power Field Effect Transistor (FET) is designed to exceed expectations. Whether you're working on industrial applications or automotive projects, this N-CHANNEL transistor offers incredible reliability and efficiency. Say goodbye to subpar performance and hello to a world of possibilities with Onsemi's NTMYS008N08LHTWG. Unlock the true potential of your projects with this powerhouse of a component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel, making this product a reliable choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making the product more efficient.

Maximum Pulsed Drain Current (IDM): 319 A

The high pulsed drain current capability allows the product to handle power surges effectively.

Maximum Power Dissipation (Abs): 73 W

With a high power dissipation rating, this product can handle heat efficiently, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide semiconductor technology offers high efficiency and fast switching speeds, making the product suitable for power applications.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the product to function reliably in demanding conditions.

Maximum Drain-Source On Resistance: 0.011 ohm

Low on-resistance ensures minimal power loss and efficient power handling, making this product ideal for power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS008N08LHTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

267 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

59 A

Maximum Drain Current (ID):

59 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

319 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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