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NTMYS025N06CLTWG

Onsemi

NTMYS025N06CLTWG by Onsemi

NTMYS025N06CLTWG by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 103A IDM. Ideal for applications requiring high power dissipation, it operates in enhancement mode with a max temperature of 175°C. The transistor features a built-in diode, 0.043 ohm Drain-Source Resistance, and is suitable for surface mount configurations.

Median Price

$0.760

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 10 parts In-Stock

1+ parts

$0.190

100+ parts

$0.190

1k+ parts

$0.190

10k+ parts

-

10

$0.190

$0.190

$0.190

-

Mouser Electronics

USA . 2,379 parts In-Stock

1+ parts

$1.780

100+ parts

$0.761

1k+ parts

$0.550

10k+ parts

$0.513

2,379

$1.780

$0.761

$0.550

$0.513

DigiKey

USA . 1,385 parts In-Stock

1+ parts

$1.780

100+ parts

$0.761

1k+ parts

$0.550

10k+ parts

$0.448

1,385

$1.780

$0.761

$0.550

$0.448

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.420

3,000

-

-

-

$0.420

Farnell

UK . 2,730 parts In-Stock

1+ parts

-

100+ parts

$0.760

1k+ parts

$0.612

10k+ parts

$0.600

2,730

-

$0.760

$0.612

$0.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,248 parts In-Stock

1+ parts

$0.180

100+ parts

-

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2,248

$0.180

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-

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.007

100+ parts

-

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750

$2.007

-

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Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

-

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6,000

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.608

6,000

-

-

-

$0.608

Vyrian

USA . 3,140 parts In-Stock

1+ parts

-

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3,140

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IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.849

3,000

-

-

-

$0.849

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,008 parts In-Stock

1+ parts

$0.162

100+ parts

-

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3,008

$0.162

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Corphita

USA . 1,135 parts In-Stock

1+ parts

$0.171

100+ parts

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1,135

$0.171

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Corohmni

South Africa . 136 parts In-Stock

1+ parts

$0.422

100+ parts

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136

$0.422

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.007

100+ parts

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100

$2.007

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Component Stockers USA

USA . 12,789 parts In-Stock

1+ parts

$6.770

100+ parts

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12,789

$6.770

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Microchip USA

USA . 7,067 parts In-Stock

1+ parts

$12.681

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7,067

$12.681

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TANS Electronics

Latvia . 8,307 parts In-Stock

1+ parts

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8,307

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SupplyDigital Components

Austria . 5,346 parts In-Stock

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5,346

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Kulean Microsystems

USA . 3,258 parts In-Stock

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3,258

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

1+ parts

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3,000

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UHIMA Technologies

Türkiye . 693 parts In-Stock

1+ parts

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693

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Problanco Electronics

Mexico . 560 parts In-Stock

1+ parts

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560

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Overview

Experience the power of top-quality performance with the Onsemi NTMYS025N06CLTWG Power Field Effect Transistor. Known for their superior manufacturing standards, Onsemi delivers cutting-edge technology in a compact package. Ideal for a variety of applications, this N-CHANNEL FET offers customers reliability, efficiency, and durability like no other. Say goodbye to compromise and hello to unparalleled value with the NTMYS025N06CLTWG by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better performance characteristics, such as lower on-resistance and higher current-carrying capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient operation and protection against reverse current flow.

Surface Mount: YES

Surface mount capability simplifies the assembly process and saves space on the circuit board.

Minimum DS Breakdown Voltage: 60 V

High breakdown voltage ensures that the FET can handle higher voltage applications without breakdown.

Maximum Power Dissipation (Abs): 24 W

High power dissipation rating allows the FET to handle large amounts of power without overheating.

Maximum Drain Current (ID): 8.5 A

The high drain current rating makes this FET suitable for applications requiring high current levels.

Maximum Drain-Source On Resistance: 0.043 ohm

Low on-resistance means the FET will have minimal power loss and operate more efficiently.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to be used in a wide variety of environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS025N06CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

44.6 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

8.5 A

Maximum Drain-Source On Resistance:

.043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

103 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMYS025N06CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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