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NTMYS013N08LHTWG

Onsemi

NTMYS013N08LHTWG by Onsemi

NTMYS013N08LHTWG by Onsemi is a N-CHANNEL FET with 80V DS Breakdown Voltage, 208A IDM, and 0.017 ohm RDS(on). Ideal for power applications in small outline packages, operating from -55 to 175 °C.

Median Price

$1.156

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,942 parts In-Stock

1+ parts

$2.810

100+ parts

$1.930

1k+ parts

$1.390

10k+ parts

$0.930

2,942

$2.810

$1.930

$1.390

$0.930

DigiKey

USA . 15,000 parts In-Stock

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$1.160

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$1.160

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Flip Electronics (Authorized)

USA . 15,000 parts In-Stock

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15,000

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Rochester

USA . 1,921 parts In-Stock

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100+ parts

$1.110

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$0.921

10k+ parts

$0.821

1,921

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$1.110

$0.921

$0.821

Verical

USA . 1,921 parts In-Stock

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-

100+ parts

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$1.152

10k+ parts

$1.027

1,921

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-

$1.152

$1.027

Distributors (In-Stock)

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Digiode

USA . 569 parts In-Stock

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$0.859

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569

$0.859

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Vyrian

USA . 1,786 parts In-Stock

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$0.904

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1,786

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Flip Electronics

USA . 21,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 656 parts In-Stock

1+ parts

$0.814

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656

$0.814

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Corohmni

South Africa . 434 parts In-Stock

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$0.904

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434

$0.904

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Problanco Electronics

Mexico . 7,129 parts In-Stock

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TANS Electronics

Latvia . 6,055 parts In-Stock

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SupplyDigital Components

Austria . 5,381 parts In-Stock

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Kulean Microsystems

USA . 4,313 parts In-Stock

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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Overview

Discover the cutting-edge NTMYS013N08LHTWG by Onsemi, a top-tier Power Field Effect Transistor that guarantees unrivaled performance and reliability. Manufactured with precision and expertise, this N-CHANNEL FET offers a seamless configuration with a built-in diode, making it ideal for a wide range of applications. With a high DS Breakdown Voltage of 80V and a maximum Drain Current of 42A, this transistor ensures optimal power management in any operating mode. Experience the value and benefits of this product as it delivers superior efficiency and durability, setting a new standard in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the product suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for high power applications due to their superior conductivity and efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and implementation, reducing the need for additional components.

Surface Mount: YES

SMT technology enables easy and compact PCB assembly, saving space and improving overall system performance.

Maximum Drain-Source On Resistance: 0.017 ohm

Low on-resistance results in minimal power loss and improved efficiency, making the product ideal for high current applications.

Maximum Power Dissipation (Abs): 54 W

High power dissipation capability allows the FET to handle heavy loads without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures, making it suitable for demanding industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS013N08LHTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

207 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

208 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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