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NTMYS020N08LHTWG

Onsemi

NTMYS020N08LHTWG by Onsemi

NTMYS020N08LHTWG by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage, 142A IDM, and 0.025 ohm RDS(on). Ideal for power management applications requiring high drain current handling capabilities. Operates in enhancement mode with a max operating temperature of 175 °C.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$2.690

100+ parts

$1.820

1k+ parts

$1.310

10k+ parts

$0.877

3,000

$2.690

$1.820

$1.310

$0.877

DigiKey

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.810

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12,000

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$0.810

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Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

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12,000

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Rochester

USA . 2,473 parts In-Stock

1+ parts

-

100+ parts

$1.040

1k+ parts

$0.863

10k+ parts

$0.770

2,473

-

$1.040

$0.863

$0.770

Verical

USA . 2,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.079

10k+ parts

$0.962

2,473

-

-

$1.079

$0.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,193 parts In-Stock

1+ parts

$0.809

100+ parts

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1,193

$0.809

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Vyrian

USA . 1,007 parts In-Stock

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$0.810

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1,007

$0.810

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Flip Electronics

USA . 12,000 parts In-Stock

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12,000

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Distributors (Availability)

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Corphita

USA . 1,857 parts In-Stock

1+ parts

$0.767

100+ parts

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1,857

$0.767

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Corohmni

South Africa . 407 parts In-Stock

1+ parts

$0.810

100+ parts

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407

$0.810

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Problanco Electronics

Mexico . 7,907 parts In-Stock

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7,907

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Kulean Microsystems

USA . 7,745 parts In-Stock

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SupplyDigital Components

Austria . 7,011 parts In-Stock

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7,011

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TANS Electronics

Latvia . 1,788 parts In-Stock

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1,788

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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Overview

Discover the power and reliability of the NTMYS020N08LHTWG by Onsemi, a top-tier manufacturer known for delivering exceptional quality in Power Field Effect Transistors (FET). This N-CHANNEL transistor boasts a single configuration with a built-in diode, making it ideal for a wide range of applications. From enhancing performance to maximizing efficiency, this transistor offers customers unparalleled value and benefits. Trust in Onsemi's expertise and choose the NTMYS020N08LHTWG for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the transistor, making it durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current carrying capabilities compared to P-channel FETs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can provide protection against reverse voltage spikes, making this product versatile and efficient.

Surface Mount: YES

Being surface mountable allows for easy integration into compact electronic devices, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 80 V

The high minimum breakdown voltage ensures reliable operation in applications where high voltages are present, offering robust protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 142 A

The high pulsed drain current rating allows for handling sudden surge currents, making this FET suitable for power electronics applications that require high peak current capabilities.

Maximum Power Dissipation (Abs): 42 W

With a high power dissipation rating, this FET can effectively handle heat generated during operation, ensuring reliable performance under high power conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance enables this FET to operate in a wide range of temperature environments, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS020N08LHTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

198 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

142 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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