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NTMYS2D9N04CLTWG

Onsemi

NTMYS2D9N04CLTWG by Onsemi

NTMYS2D9N04CLTWG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 740A IDM. Ideal for power management applications, it features a single configuration with built-in diode in a small outline package, operating in enhancement mode from -55 to 175 °C.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,949 parts In-Stock

1+ parts

$2.940

100+ parts

$1.317

1k+ parts

$1.092

10k+ parts

$0.892

2,949

$2.940

$1.317

$1.092

$0.892

Rochester

USA . 3,297 parts In-Stock

1+ parts

-

100+ parts

$1.210

1k+ parts

$1.000

10k+ parts

$0.895

3,297

-

$1.210

$1.000

$0.895

Verical

USA . 3,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.250

10k+ parts

$1.119

3,297

-

-

$1.250

$1.119

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

1+ parts

-

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-

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3,000

-

-

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Distributors (In-Stock)

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Digiode

USA . 2,212 parts In-Stock

1+ parts

$0.942

100+ parts

-

1k+ parts

-

10k+ parts

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2,212

$0.942

-

-

-

Vyrian

USA . 1,134 parts In-Stock

1+ parts

$0.992

100+ parts

-

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1,134

$0.992

-

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Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

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3,000

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,508 parts In-Stock

1+ parts

$0.893

100+ parts

-

1k+ parts

-

10k+ parts

-

1,508

$0.893

-

-

-

Corohmni

South Africa . 363 parts In-Stock

1+ parts

$0.992

100+ parts

-

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363

$0.992

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 16,807 parts In-Stock

1+ parts

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16,807

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 5,891 parts In-Stock

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5,891

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TANS Electronics

Latvia . 5,765 parts In-Stock

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5,765

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Continental Prestige Electronics

USA . 3,297 parts In-Stock

1+ parts

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100+ parts

$2.030

1k+ parts

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3,297

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$2.030

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Kulean Microsystems

USA . 3,285 parts In-Stock

1+ parts

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3,285

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iodParts Technologies Inc.

India . 3,016 parts In-Stock

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3,016

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Problanco Electronics

Mexico . 1,417 parts In-Stock

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1,417

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SupplyDigital Components

Austria . 906 parts In-Stock

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906

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UHIMA Technologies

Türkiye . 215 parts In-Stock

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215

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Overview

Unlock the power of innovation with the NTMYS2D9N04CLTWG by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) boasts top-notch quality and reliability. Ideal for a wide range of applications, this N-CHANNEL transistor offers unparalleled performance and efficiency. From its single configuration with built-in diode to its high maximum drain current and low on-resistance, this product delivers exceptional value to customers seeking cutting-edge solutions. Experience the difference with Onsemi's advanced technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency compared to P-channel FETs, making this product a good choice for power applications.

Maximum Pulsed Drain Current (IDM): 740 A

The high pulsed drain current rating of 740A allows this FET to handle large power surges and spikes effectively, making it ideal for power management applications.

Maximum Power Dissipation (Abs): 68 W

With a maximum power dissipation of 68W, this FET can continuously handle high power levels without the risk of overheating, ensuring reliable operation.

Maximum Drain-Source On Resistance: 0.0028 ohm

The low drain-source on resistance of 0.0028 ohm results in minimal power loss and high efficiency in the switching operation of the FET, making it a suitable choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS2D9N04CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

215 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

42 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

740 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMYS2D9N04CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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