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NTMYS1D3N04CTWG

Onsemi

NTMYS1D3N04CTWG by Onsemi

NTMYS1D3N04CTWG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 900A IDM. Ideal for applications requiring high power dissipation, such as motor control systems or power supplies. Features include a built-in diode, small outline package style, and -55 to 175 °C operating temperature range.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 41,383 parts In-Stock

1+ parts

-

100+ parts

$1.060

1k+ parts

$0.880

10k+ parts

$0.784

41,383

-

$1.060

$0.880

$0.784

Verical

USA . 37,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.100

10k+ parts

$0.981

37,809

-

-

$1.100

$0.981

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,012 parts In-Stock

1+ parts

$0.823

100+ parts

-

1k+ parts

-

10k+ parts

-

1,012

$0.823

-

-

-

Vyrian

USA . 1,678 parts In-Stock

1+ parts

$0.866

100+ parts

-

1k+ parts

-

10k+ parts

-

1,678

$0.866

-

-

-

Flip Electronics

USA . 323 parts In-Stock

1+ parts

-

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-

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323

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 969 parts In-Stock

1+ parts

$0.779

100+ parts

-

1k+ parts

-

10k+ parts

-

969

$0.779

-

-

-

Corohmni

South Africa . 426 parts In-Stock

1+ parts

$0.866

100+ parts

-

1k+ parts

-

10k+ parts

-

426

$0.866

-

-

-

Component Stockers USA

USA . 33,175 parts In-Stock

1+ parts

$0.890

100+ parts

$0.840

1k+ parts

$0.760

10k+ parts

$0.760

33,175

$0.890

$0.840

$0.760

$0.760

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,000

-

-

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Kulean Microsystems

USA . 5,848 parts In-Stock

1+ parts

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100+ parts

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5,848

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-

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Problanco Electronics

Mexico . 3,388 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,388

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SupplyDigital Components

Austria . 3,307 parts In-Stock

1+ parts

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100+ parts

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3,307

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-

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TANS Electronics

Latvia . 1,819 parts In-Stock

1+ parts

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100+ parts

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1,819

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UHIMA Technologies

Türkiye . 720 parts In-Stock

1+ parts

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720

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Overview

Elevate your power management capabilities with the NTMYS1D3N04CTWG by Onsemi. Crafted with precision and reliability in mind, this Power Field Effect Transistor (FET) boasts a single configuration with a built-in diode, making it perfect for a wide range of applications. From enhancing circuit efficiency to providing superior performance, this N-CHANNEL FET offers a maximum pulsed drain current of 900A and an avalanche energy rating of 1621mJ. Trust in Onsemi's expertise and experience to deliver top-notch quality and value with every use. Step up your power game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current in one direction, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Provides additional functionality with the built-in diode, making it versatile for different circuit designs.

Surface Mount: YES

Enables easy and secure installation onto circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 40 V

Offers a sufficient voltage threshold to protect the FET from damage during operation.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit layouts and designs.

Operating Mode: ENHANCEMENT MODE

Allows for precise control over the FET's conductivity, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 900 A

Provides high current handling capacity, suitable for demanding applications.

Avalanche Energy Rating (EAS): 1621 mJ

Withstands high energy spikes and transients, ensuring reliable operation under varying conditions.

Maximum Drain Current (Abs) (ID): 252 A

Offers a high continuous current rating for sustained performance.

No. of Terminals: 4

Facilitates easy connections in circuit layouts, ensuring proper functionality.

Maximum Power Dissipation (Abs): 134 W

Can handle high power levels, suitable for applications requiring significant power dissipation.

Package Style (Meter): SMALL OUTLINE

Saves space on circuit boards and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures efficient operation and reliability in various electronic circuits.

Maximum Operating Temperature: 175 °C

Can withstand high operating temperatures, suitable for demanding environments.

Transistor Element Material: SILICON

Offers superior performance and reliability compared to other materials.

Minimum Operating Temperature: -55 °C

Provides a wide operating temperature range, suitable for diverse applications.

Terminal Finish: MATTE TIN

Enhances solderability and ensures secure connections with other components.

Maximum Drain-Source On Resistance: 0.00115 ohm

Provides low resistance for efficient current flow.

Terminal Position: SINGLE

Simplifies installation and connection in circuit layouts.

Case Connection: DRAIN

Offers a common connection point for ease of circuit design and layout.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly processes.

Peak Reflow Temperature °C: 260

Optimal temperature for soldering, ensuring reliable connections.

Maximum Feedback Capacitance (Crss): 71 pF

Controls the feedback capacitance for improved stability in circuit operations.

Technical Specifications

Power Field Effect Transistors (FET) NTMYS1D3N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1621 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

252 A

Maximum Drain Current (ID):

252 A

Maximum Drain-Source On Resistance:

.00115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

71 pF

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMYS1D3N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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