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NTMKE4890NT1G

Onsemi

NTMKE4890NT1G by Onsemi

NTMKE4890NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 237A IDM, and 0.00245 ohm RDS(ON). Ideal for SWITCHING applications, it features ENHANCEMENT MODE operation in a CHIP CARRIER package.

Median Price

$0.699

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.559

10k+ parts

$0.498

21,000

-

$0.674

$0.559

$0.498

DigiKey

USA . 21,000 parts In-Stock

1+ parts

-

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-

1k+ parts

$0.840

10k+ parts

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21,000

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-

$0.840

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Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.699

10k+ parts

$0.623

21,000

-

-

$0.699

$0.623

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 448 parts In-Stock

1+ parts

$0.524

100+ parts

-

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448

$0.524

-

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Vyrian

USA . 2,363 parts In-Stock

1+ parts

$0.552

100+ parts

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2,363

$0.552

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DigiKey Marketplace

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$0.570

1k+ parts

-

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21,000

-

$0.570

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Distributors (Availability)

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Corohmni

South Africa . 447 parts In-Stock

1+ parts

$0.452

100+ parts

-

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447

$0.452

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Corphita

USA . 1,340 parts In-Stock

1+ parts

$0.497

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1,340

$0.497

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Microchip USA

USA . 3,205 parts In-Stock

1+ parts

$3.445

100+ parts

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3,205

$3.445

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Continental Prestige Electronics

USA . 21,000 parts In-Stock

1+ parts

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100+ parts

$0.507

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21,000

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$0.507

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Kulean Microsystems

USA . 6,104 parts In-Stock

1+ parts

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6,104

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TANS Electronics

Latvia . 5,646 parts In-Stock

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5,646

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Problanco Electronics

Mexico . 4,730 parts In-Stock

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4,730

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SupplyDigital Components

Austria . 2,920 parts In-Stock

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2,920

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UHIMA Technologies

Türkiye . 638 parts In-Stock

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638

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Overview

Get ready to experience top-notch quality and performance with the NTMKE4890NT1G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers reliability and innovation in every product. This N-CHANNEL Power Field Effect Transistor with a built-in diode is perfect for switching applications, offering enhanced efficiency and power management. With a high pulsed drain current of 237 A and a low on resistance of 0.00245 ohm, this transistor ensures optimal functionality and durability. Upgrade your electronic devices with the NTMKE4890NT1G and enjoy seamless operation like never before!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making this product suitable for applications requiring quick response times.

Minimum DS Breakdown Voltage: 30 V

With a high minimum breakdown voltage, this FET can handle higher voltages and provide better reliability in various electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in preventing reverse current flow and protects the circuit from damage, increasing the overall reliability of the product.

Maximum Pulsed Drain Current (IDM): 237 A

The high pulsed drain current rating allows this FET to handle large currents for short durations, making it ideal for high-power applications.

Avalanche Energy Rating (EAS): 505 mJ

The high avalanche energy rating indicates that this FET can handle large energy spikes without breaking down, ensuring the longevity of the device.

Maximum Drain Current (ID): 30 A

With a high maximum drain current rating, this FET can handle continuous high currents without overheating, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.00245 ohm

The low on-resistance of the FET results in minimal power loss and improved efficiency, making it an excellent choice for high-power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMKE4890NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

505 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.00245 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

237 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMKE4890NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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