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NTMKE4892NT1G

Onsemi

NTMKE4892NT1G by Onsemi

NTMKE4892NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 210A IDM, and 0.0026 ohm RDS(on). Ideal for SWITCHING applications in ENHANCEMENT MODE, this chip carrier package features a built-in diode and operates in BOTTOM terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,794 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 819 parts In-Stock

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SupplyDigital Components

Austria . 8,357 parts In-Stock

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Kulean Microsystems

USA . 7,525 parts In-Stock

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Problanco Electronics

Mexico . 6,911 parts In-Stock

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TANS Electronics

Latvia . 6,867 parts In-Stock

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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Corohmni

South Africa . 356 parts In-Stock

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Corphita

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Overview

Unlock the power of innovation with the NTMKE4892NT1G by Onsemi, a top-tier manufacturer known for quality and reliability. As a leading player in the Power Field Effect Transistors (FET) category, this N-CHANNEL transistor offers unmatched performance in SWITCHING applications. With a built-in diode and ENHANCEMENT MODE operation, customers can trust in its superior capabilities. Whether you're looking to optimize efficiency or enhance productivity, this product delivers value, benefits, and advantages that go beyond expectations. Trust Onsemi for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications due to their enhanced conductivity and efficiency.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage allows for reliable performance in high voltage applications.

Maximum Pulsed Drain Current (IDM): 210 A

The high pulsed drain current rating makes this FET suitable for applications requiring high power handling capabilities.

Avalanche Energy Rating (EAS): 290 mJ

The high avalanche energy rating indicates the FET's ability to withstand transient voltage spikes without damage.

Maximum Drain Current (ID): 26 A

The high drain current rating allows for reliable performance in applications requiring high current handling capabilities.

Maximum Drain-Source On Resistance: 0.0026 ohm

The low on-resistance leads to reduced power dissipation and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMKE4892NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

290 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

26 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

210 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMKE4892NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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