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NTMKB4893NT3G

Onsemi

NTMKB4893NT3G by Onsemi

NTMKB4893NT3G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 124A IDM, and 0.0054 ohm RDS. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 65W.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,210 parts In-Stock

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Digiode

USA . 1,822 parts In-Stock

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TANS Electronics

Latvia . 5,269 parts In-Stock

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Problanco Electronics

Mexico . 3,704 parts In-Stock

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Kulean Microsystems

USA . 2,492 parts In-Stock

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UHIMA Technologies

Türkiye . 877 parts In-Stock

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Corphita

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Corohmni

South Africa . 259 parts In-Stock

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SupplyDigital Components

Austria . 12 parts In-Stock

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Overview

Experience the power of innovation with the NTMKB4893NT3G by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted a high-quality Power Field Effect Transistor that offers unparalleled performance in switching applications. With a single configuration and built-in diode, this N-CHANNEL transistor is designed for efficiency and reliability. Whether you're looking to enhance your electronic devices or optimize power management systems, the NTMKB4893NT3G provides exceptional value, benefits, and advantages that will elevate your projects to new heights. Trust in Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher switching speeds compared to P-channel FETs, making them suitable for high efficiency applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power control and management.

Minimum DS Breakdown Voltage: 25 V

Can handle higher voltages, making it suitable for various industrial and automotive applications.

Maximum Pulsed Drain Current (IDM): 124 A

Capable of handling high current pulses for short durations, ideal for power electronics applications.

Maximum Power Dissipation (Abs): 65 W

With a high power dissipation capability, it can handle significant amounts of power without overheating.

Maximum Operating Temperature: 150 °C

Can operate effectively at high temperatures without compromising performance, suitable for harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NTMKB4893NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

79.4 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

87 A

Maximum Drain Current (ID):

15.8 A

Maximum Drain-Source On Resistance:

.0054 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

124 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMKB4893NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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