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NTMKE4894NT3G

Onsemi

NTMKE4894NT3G by Onsemi

NTMKE4894NT3G by Onsemi is a N-CHANNEL Power FET with 25V DS Breakdown Voltage and 33A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 250A Pulsed Drain Current, and 0.0024 ohm On Resistance. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 73.5W and can withstand temperatures up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,217 parts In-Stock

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Digiode

USA . 867 parts In-Stock

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SupplyDigital Components

Austria . 7,490 parts In-Stock

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TANS Electronics

Latvia . 3,352 parts In-Stock

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UHIMA Technologies

Türkiye . 581 parts In-Stock

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Kulean Microsystems

USA . 537 parts In-Stock

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Problanco Electronics

Mexico . 390 parts In-Stock

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Corphita

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Corohmni

South Africa . 117 parts In-Stock

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Overview

Upgrade your power systems with the NTMKE4894NT3G by Onsemi, a high-quality N-CHANNEL Power FET with a built-in diode for enhanced performance. Ideal for switching applications, this surface-mount transistor offers a maximum pulsing drain current of 250A and a minimum DS breakdown voltage of 25V. With a compact chip carrier package style and top-of-the-line metal-oxide semiconductor technology, this transistor ensures reliability and efficiency in any project. Experience the value and benefits of Onsemi's innovative design today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors offer higher mobility and faster switching speed compared to P-CHANNEL transistors, making them ideal for high performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation in various electronic circuits.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this FET can handle high voltage applications without risk of damage.

Maximum Pulsed Drain Current (IDM): 250 A

Capable of handling high current pulses, making it suitable for applications requiring temporary high power output.

Avalanche Energy Rating (EAS): 577 mJ

Has a high avalanche energy rating, ensuring protection against voltage spikes and surges in the circuit.

Maximum Power Dissipation (Abs): 73.5 W

Can dissipate up to 73.5W of power, making it suitable for high power applications where heat dissipation is crucial.

Maximum Drain-Source On Resistance: 0.0024 ohm

Low on-resistance minimizes power loss and heat generation, improving efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMKE4894NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

577 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

33 A

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.0024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

250 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMKE4894NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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