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NTMKB4895NT1G

Onsemi

NTMKB4895NT1G by Onsemi

The Onsemi NTMKB4895NT1G is a N-CHANNEL FET with 30V DS Breakdown Voltage and 120A IDM. Ideal for SWITCHING applications, it features 0.006 ohm Drain-Source Resistance and 80mJ EAS rating. This ENHANCEMENT MODE transistor in CHIP CARRIER package is suitable for high-power circuit designs.

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Lifecycle Status

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1k+

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Vyrian

USA . 6,594 parts In-Stock

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AZTECH Wire

Italy . 737 parts In-Stock

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Problanco Electronics

Mexico . 5,467 parts In-Stock

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TANS Electronics

Latvia . 5,104 parts In-Stock

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SupplyDigital Components

Austria . 4,496 parts In-Stock

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Kulean Microsystems

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Corphita

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Corohmni

South Africa . 492 parts In-Stock

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UHIMA Technologies

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Overview

Unleash the power of innovation with the NTMKB4895NT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers unparalleled reliability and performance. Experience enhanced efficiency and seamless operation with a maximum drain current of 15A and a minimum DS breakdown voltage of 30V. Step into the future of technology with Onsemi's cutting-edge solutions.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance compared to P-CHANNEL FETs, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, which is essential in many switching applications to prevent damage to the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and efficiency.

Minimum DS Breakdown Voltage: 30 V

Provides a high breakdown voltage, making this FET suitable for applications where high voltages are present.

Maximum Pulsed Drain Current (IDM): 120 A

Capable of handling high pulsed currents, making it suitable for applications requiring high power levels.

Avalanche Energy Rating (EAS): 80 mJ

The high avalanche energy rating ensures the FET can handle spikes in voltage without failure, increasing the overall reliability of the circuit.

Maximum Drain Current (ID): 15 A

Capable of handling high continuous currents, making it suitable for applications where sustained power delivery is required.

Maximum Drain-Source On Resistance: 0.006 ohm

Low ON resistance results in minimal power loss and efficient switching performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMKB4895NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMKB4895NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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