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NTMKB4893NT1G

Onsemi

NTMKB4893NT1G by Onsemi

NTMKB4893NT1G by Onsemi is a N-CHANNEL Power FET with 25V DS Breakdown Voltage and 124A IDM. Ideal for SWITCHING applications, it features 0.0054 ohm RDS(on) and 79.4 mJ EAS rating in a CHIP CARRIER package.

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Lifecycle Status

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1k+

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Digiode

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TANS Electronics

Latvia . 7,312 parts In-Stock

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SupplyDigital Components

Austria . 7,159 parts In-Stock

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Problanco Electronics

Mexico . 3,484 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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Corohmni

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Kulean Microsystems

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Overview

Looking for a reliable Power Field Effect Transistor (FET) for your switching applications? Look no further than the NTMKB4893NT1G by Onsemi. With its N-CHANNEL configuration, built-in diode, and high-quality silicon material, this transistor offers enhanced performance and reliability. Whether you're designing power supplies, motor controls, or LED lighting systems, this transistor provides maximum pulsing drain current and low drain-source resistance for efficient operation. Trust Onsemi's expertise in semiconductor technology and choose NTMKB4893NT1G for superior results in your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in high-power applications due to their lower ON-state resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy reverse current flow prevention, enhancing the overall reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage: 25 V

The minimum breakdown voltage ensures the FET can handle high voltage spikes, making it suitable for various industrial applications.

Surface Mount: YES

The surface mount feature makes for easy and compact circuit board assembly, saving space in applications with limited real estate.

Maximum Pulsed Drain Current (IDM): 124 A

The high pulsed drain current rating allows the FET to handle short bursts of high current, making it ideal for power-heavy applications.

Avalanche Energy Rating (EAS): 79.4 mJ

The high avalanche energy rating makes the FET more robust against voltage spikes and transient surges, improving overall system reliability.

Maximum Drain Current (ID): 15.8 A

With a high maximum drain current rating, this FET can reliably handle large continuous currents without overheating or failing.

Maximum Drain-Source On Resistance: 0.0054 ohm

The low ON resistance results in minimal power losses and heat generation, leading to higher efficiency and better overall performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMKB4893NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

79.4 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

15.8 A

Maximum Drain-Source On Resistance:

.0054 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

124 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMKB4893NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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