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NTMKE4891NT3G

Onsemi

NTMKE4891NT3G by Onsemi

NTMKE4891NT3G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features 210A IDM and 0.0026 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 150 °C. Suitable for power electronics requiring high current handling and low on-resistance.

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Digiode

USA . 867 parts In-Stock

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Vyrian

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Problanco Electronics

Mexico . 5,657 parts In-Stock

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Kulean Microsystems

USA . 5,582 parts In-Stock

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SupplyDigital Components

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TANS Electronics

Latvia . 1,865 parts In-Stock

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UHIMA Technologies

Türkiye . 691 parts In-Stock

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Corphita

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Overview

Elevate your power management solutions with the NTMKE4891NT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like this N-CHANNEL transistor with a built-in diode for enhanced performance. Ideal for switching applications, this surface-mount transistor offers a robust design and maximum pulsed drain current of 210A. With its high energy rating and low on-resistance, this chip carrier package provides customers with reliability and efficiency in their power systems. Upgrade your devices today with the NTMKE4891NT3G and experience the difference in power management technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs have lower resistance and faster switching speeds compared to P-CHANNEL FETs, making them more efficient for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection, making the product more reliable in certain applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and efficient on/off operation.

Surface Mount: YES

Surface mounting allows for easy and compact installation on circuit boards, saving space in the overall design.

Minimum DS Breakdown Voltage: 25V

With a minimum breakdown voltage of 25V, this FET can handle high voltage applications effectively.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and efficient use of board space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and are normally off, providing better control over the switching operation.

Maximum Pulsed Drain Current (IDM): 210A

With a high pulsed drain current rating, this FET can handle short-term high current loads efficiently.

Avalanche Energy Rating (EAS): 184mJ

The high avalanche energy rating ensures the FET can withstand short high-energy pulses without damage, improving reliability.

No. of Terminals: 3

Having only 3 terminals simplifies the circuit design and reduces the chance of wiring errors.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides good heat dissipation and compact size, ideal for high power density applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer low gate drive power, high input impedance, and fast switching speed, making them efficient for various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the FET can withstand elevated temperatures and continue functioning reliably.

Transistor Element Material: SILICON

Silicon-based FETs provide good performance, reliability, and cost-effectiveness for a wide range of applications.

Maximum Drain Current (ID): 26.7A

With a high maximum drain current rating, this FET can handle continuous high current loads effectively.

Maximum Drain-Source On Resistance: 0.0026 ohm

The low on-resistance minimizes power losses and heat generation in the FET, improving efficiency.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and soldering, simplifying the assembly process.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation from the FET, improving overall thermal performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMKE4891NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

184 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

26.7 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

210 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMKE4891NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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