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NTMJS1D15N03CGTWG

Onsemi

NTMJS1D15N03CGTWG by Onsemi

NTMJS1D15N03CGTWG by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 900A and EAS of 354mJ, suitable for high-power operations. With an operating temperature range from -55 to 175 °C, this MOSFET offers efficient performance in various environments.

Median Price

$3.409

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 24,000 parts In-Stock

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24,000

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Rochester

USA . 5,173 parts In-Stock

1+ parts

-

100+ parts

$2.380

1k+ parts

$2.130

10k+ parts

$2.000

5,173

-

$2.380

$2.130

$2.000

Verical

USA . 5,173 parts In-Stock

1+ parts

-

100+ parts

$4.438

1k+ parts

$3.975

10k+ parts

$3.737

5,173

-

$4.438

$3.975

$3.737

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,458 parts In-Stock

1+ parts

$3.762

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1,458

$3.762

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Vyrian

USA . 1,215 parts In-Stock

1+ parts

$3.960

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1,215

$3.960

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Flip Electronics

USA . 24,000 parts In-Stock

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24,000

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Distributors (Availability)

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Corphita

USA . 1,187 parts In-Stock

1+ parts

$3.564

100+ parts

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1,187

$3.564

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Corohmni

South Africa . 366 parts In-Stock

1+ parts

$3.960

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366

$3.960

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Kulean Microsystems

USA . 8,376 parts In-Stock

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8,376

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TANS Electronics

Latvia . 6,622 parts In-Stock

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6,622

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Problanco Electronics

Mexico . 4,644 parts In-Stock

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4,644

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SupplyDigital Components

Austria . 3,163 parts In-Stock

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3,163

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UHIMA Technologies

Türkiye . 717 parts In-Stock

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717

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Discover the NTMJS1D15N03CGTWG by Onsemi, a top-tier Power Field Effect Transistor that guarantees exceptional quality and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor with a built-in diode is ideal for switching applications. With a maximum power dissipation of 125W and a minimum DS breakdown voltage of 30V, this transistor offers unmatched performance and efficiency. Trust Onsemi to deliver cutting-edge technology and innovative solutions for all your power needs. Elevate your projects with the NTMJS1D15N03CGTWG and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher efficiency, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes and reverse currents, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast response times and efficient performance.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages without damage.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off, reducing power consumption and improving efficiency.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating allows the transistor to handle short bursts of high current, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 354 mJ

The high avalanche energy rating indicates that the transistor can withstand voltage spikes and transient events, increasing its durability.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this transistor can handle higher power levels without overheating.

Maximum Drain-Source On Resistance: 0.00115 ohm

Low on-resistance reduces power loss and improves efficiency when the transistor is conducting.

Maximum Operating Temperature: 175 °C

The high operating temperature allows the transistor to operate reliably in a wide range of environments.

Minimum Operating Temperature: -55 °C

The wide operating temperature range makes this transistor suitable for both high and low temperature applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMJS1D15N03CGTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

354 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

257 A

Maximum Drain-Source On Resistance:

.00115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

99 pF

JESD-30 Code:

R-PDSO-X8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMJS1D15N03CGTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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