Loading...

NTMJS0D9N04CTWG

Onsemi

NTMJS0D9N04CTWG by Onsemi

NTMJS0D9N04CTWG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, 900A IDM, and 1945mJ EAS. Ideal for high-power applications requiring low on-resistance and high current handling capabilities. Suitable for use in power supplies, motor control, and automotive systems due to its high power dissipation of 180W and operating temperature range of -55 to 175 °C.

Median Price

$1.438

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,963 parts In-Stock

1+ parts

$3.250

100+ parts

$1.469

1k+ parts

$1.252

10k+ parts

$1.022

2,963

$3.250

$1.469

$1.252

$1.022

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.288

3,000

-

-

$1.438

$1.288

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

3,000

-

$1.390

$1.150

$1.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,551 parts In-Stock

1+ parts

$3.952

100+ parts

-

1k+ parts

-

10k+ parts

-

1,551

$3.952

-

-

-

Vyrian

USA . 1,569 parts In-Stock

1+ parts

$4.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,569

$4.160

-

-

-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 312 parts In-Stock

1+ parts

$3.490

100+ parts

-

1k+ parts

-

10k+ parts

-

312

$3.490

-

-

-

Corphita

USA . 1,024 parts In-Stock

1+ parts

$3.744

100+ parts

-

1k+ parts

-

10k+ parts

-

1,024

$3.744

-

-

-

Microchip USA

USA . 7,404 parts In-Stock

1+ parts

$19.704

100+ parts

-

1k+ parts

-

10k+ parts

-

7,404

$19.704

-

-

-

Component Stockers USA

USA . 4,389 parts In-Stock

1+ parts

$33.630

100+ parts

-

1k+ parts

-

10k+ parts

-

4,389

$33.630

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,131

-

-

-

-

Problanco Electronics

Mexico . 7,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,020

-

-

-

-

SupplyDigital Components

Austria . 4,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,372

-

-

-

-

TANS Electronics

Latvia . 3,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,661

-

-

-

-

Kulean Microsystems

USA . 687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

687

-

-

-

-

UHIMA Technologies

Türkiye . 464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

464

-

-

-

-

Overview

Unlock the power of innovation with the NTMJS0D9N04CTWG by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance and reliability for a wide range of applications. From enhancing efficiency in automotive systems to optimizing power management in industrial equipment, this N-CHANNEL transistor is designed to exceed expectations. Experience the value of superior quality, efficiency, and longevity with the NTMJS0D9N04CTWG - your gateway to cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and electrical insulation, making the transistor reliable and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them suitable for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching operations, reducing overall circuit complexity.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures the FET can handle high voltages without damage, enhancing its reliability in various applications.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating allows the transistor to handle large transient currents, making it suitable for power applications with high surge currents.

Maximum Power Dissipation (Abs): 180 W

The high power dissipation rating ensures the FET can handle high power levels without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate reliably in high-temperature environments, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMJS0D9N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1945 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

342 A

Maximum Drain Current (ID):

342 A

Maximum Drain-Source On Resistance:

.00081 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

127 pF

JESD-30 Code:

R-PDSO-X5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMJS0D9N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 13