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NTMJS1D5N04CLTWG

Onsemi

NTMJS1D5N04CLTWG by Onsemi

NTMJS1D5N04CLTWG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0022 ohm RDS(on). It is used in power management applications due to its high current handling capabilities and low on-resistance.

Median Price

$2.480

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,000 parts In-Stock

1+ parts

$2.100

100+ parts

$0.933

1k+ parts

$0.735

10k+ parts

$0.608

3,000

$2.100

$0.933

$0.735

$0.608

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$2.480

100+ parts

$1.092

1k+ parts

$0.865

10k+ parts

$0.707

3,000

$2.480

$1.092

$0.865

$0.707

Mouser Electronics

USA . 3,000 parts In-Stock

1+ parts

$2.480

100+ parts

$1.100

1k+ parts

$0.841

10k+ parts

$0.808

3,000

$2.480

$1.100

$0.841

$0.808

Newark

USA . 3,000 parts In-Stock

1+ parts

$2.760

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

$2.760

-

-

-

Element14

Singapore . 3,000 parts In-Stock

1+ parts

$3.280

100+ parts

$1.460

1k+ parts

$1.070

10k+ parts

$0.978

3,000

$3.280

$1.460

$1.070

$0.978

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.725

3,000

-

-

-

$0.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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6,000

-

-

-

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.120

6,000

-

-

-

$1.120

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.339

3,000

-

-

-

$1.339

Digiode

USA . 2,373 parts In-Stock

1+ parts

-

100+ parts

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2,373

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Vyrian

USA . 2,240 parts In-Stock

1+ parts

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2,240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 4,938 parts In-Stock

1+ parts

$15.410

100+ parts

-

1k+ parts

-

10k+ parts

-

4,938

$15.410

-

-

-

Component Stockers USA

USA . 2,880 parts In-Stock

1+ parts

$31.220

100+ parts

-

1k+ parts

-

10k+ parts

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2,880

$31.220

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,066 parts In-Stock

1+ parts

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100+ parts

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15,066

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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TANS Electronics

Latvia . 7,827 parts In-Stock

1+ parts

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7,827

-

-

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Problanco Electronics

Mexico . 6,934 parts In-Stock

1+ parts

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6,934

-

-

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-

SupplyDigital Components

Austria . 4,630 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,630

-

-

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-

Kulean Microsystems

USA . 3,276 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,276

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-

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Corphita

USA . 1,911 parts In-Stock

1+ parts

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1,911

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UHIMA Technologies

Türkiye . 814 parts In-Stock

1+ parts

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814

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Corohmni

South Africa . 293 parts In-Stock

1+ parts

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293

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Overview

Unlock the power of innovation with the NTMJS1D5N04CLTWG by Onsemi. As a leader in the industry, Onsemi offers top-notch quality and reliability. This Power Field Effect Transistor (FET) provides unparalleled efficiency and performance, making it ideal for a wide range of applications. With its single configuration and built-in diode, this FET delivers exceptional value and benefits to customers. Experience the advantages of Onsemi's cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the internal components of the FET, making it reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance and higher current capabilities, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection and helps improve efficiency in the circuit design.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and making the overall design more compact.

Maximum Pulsed Drain Current (IDM): 900 A

With a high pulsed drain current rating, this FET can handle sudden spikes in power without being damaged, making it suitable for high-performance applications.

Maximum Power Dissipation (Abs): 110 W

The high power dissipation rating ensures that the FET can operate at high power levels without overheating, making it reliable in demanding conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this FET to be used in a wide range of environments, making it versatile for different applications.

Maximum Drain-Source On Resistance: 0.0022 ohm

The low ON resistance of this FET results in minimal power loss and efficient operation, making it ideal for high power applications where efficiency is crucial.

Technical Specifications

Power Field Effect Transistors (FET) NTMJS1D5N04CLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

493 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

200 A

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMJS1D5N04CLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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