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NTMJS1D0N04CTWG

Onsemi

NTMJS1D0N04CTWG by Onsemi

NTMJS1D0N04CTWG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.00092 ohm RDS(on). Ideal for power management applications requiring high drain current handling capabilities. Operates in enhancement mode with a max power dissipation of 166W at temperatures ranging from -55 to 175 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,267 parts In-Stock

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Digiode

USA . 739 parts In-Stock

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Microchip USA

USA . 5,956 parts In-Stock

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$18.584

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$18.584

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AZTECH Wire

Italy . 59 parts In-Stock

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$18.950

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Problanco Electronics

Mexico . 7,009 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,165 parts In-Stock

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Corphita

USA . 1,798 parts In-Stock

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Kulean Microsystems

USA . 668 parts In-Stock

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SupplyDigital Components

Austria . 620 parts In-Stock

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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Corohmni

South Africa . 455 parts In-Stock

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Overview

Discover the cutting-edge NTMJS1D0N04CTWG by Onsemi, a top-tier Power Field Effect Transistor with unparalleled quality and reliability. With its N-CHANNEL configuration and built-in diode, this transistor offers exceptional performance in various applications. From enhancing power efficiency to maximizing system reliability, this product delivers unmatched value to customers seeking superior power management solutions. Upgrade your projects with the NTMJS1D0N04CTWG and experience the benefits of advanced semiconductor technology at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the FET lightweight yet durable, making it easy to handle and install.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer better performance and efficiency compared to P-channel transistors, making this FET a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can help protect the circuit from reverse voltage, enhancing the overall reliability of the system.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage of 40V provides a good safety margin and allows for reliable operation in various voltage applications.

Maximum Pulsed Drain Current (IDM): 900 A

With a high pulsed drain current rating, this FET can handle surge currents effectively, making it suitable for applications that require high power handling capability.

Maximum Power Dissipation (Abs): 166 W

The high power dissipation rating ensures that the FET can handle high levels of power without overheating, making it reliable for demanding applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate in harsh environments with elevated temperatures, increasing the versatility of the product.

Maximum Drain-Source On Resistance: 0.00092 ohm

The low on-resistance ensures efficient power handling and minimal voltage drop across the FET, making it suitable for high-performance applications where low power loss is critical.

Technical Specifications

Power Field Effect Transistors (FET) NTMJS1D0N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

578 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

300 A

Maximum Drain Current (ID):

300 A

Maximum Drain-Source On Resistance:

.00092 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMJS1D0N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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