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NTMJS1D7N04CTWG

Onsemi

NTMJS1D7N04CTWG by Onsemi

NTMJS1D7N04CTWG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0017 ohm RDS(on). It is used in power applications requiring high current handling capabilities.

Median Price

$3.400

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$3.400

100+ parts

$1.542

1k+ parts

$1.329

10k+ parts

$1.085

3,000

$3.400

$1.542

$1.329

$1.085

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,204

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-

-

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Digiode

USA . 1,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,318 parts In-Stock

1+ parts

$10.455

100+ parts

-

1k+ parts

-

10k+ parts

-

5,318

$10.455

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,873 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,873

-

-

-

-

Problanco Electronics

Mexico . 6,644 parts In-Stock

1+ parts

-

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6,644

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-

-

-

iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,000

-

-

-

-

Kulean Microsystems

USA . 5,963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,963

-

-

-

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TANS Electronics

Latvia . 3,826 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,826

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SupplyDigital Components

Austria . 3,251 parts In-Stock

1+ parts

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100+ parts

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3,251

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Corphita

USA . 2,228 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,228

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UHIMA Technologies

Türkiye . 502 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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502

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-

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Corohmni

South Africa . 347 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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347

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Overview

Unleash the power of innovation with the NTMJS1D7N04CTWG from Onsemi. Designed to deliver top-notch performance, this Power FET boasts a range of applications in various industries. With its high-quality manufacturing and cutting-edge technology, this N-CHANNEL transistor offers unparalleled value and benefits to customers. Whether you need enhanced efficiency or reliable operation, this product is sure to exceed your expectations. Upgrade your systems with the NTMJS1D7N04CTWG and experience the difference that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package offers durability and protection to the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have better conductivity and lower on resistance compared to P-channel FETs, making them more efficient in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier and more efficient circuit design, simplifying the overall system architecture.

Surface Mount: YES

Surface mount capability enables easy and efficient integration into PCB assemblies, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 40 V

Higher breakdown voltage ensures better protection against voltage spikes and transients, increasing the reliability of the FET.

Package Shape: RECTANGULAR

Rectangular shape offers better utilization of space on the PCB, allowing for denser packing and optimized layout design.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides faster switching speeds and lower power consumption, enhancing overall efficiency of the FET.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current rating enables the FET to handle high peak currents, suitable for power applications with varying loads.

Avalanche Energy Rating (EAS): 338 mJ

High avalanche energy rating indicates the FET's ability to withstand energy spikes, ensuring robust performance in demanding environments.

Maximum Drain Current (Abs) (ID): 185 A

High drain current rating allows for handling of high continuous currents, making the FET suitable for power distribution and control.

No. of Terminals: 5

Having 5 terminals offers flexibility in circuit connections and options for various applications, enhancing the versatility of the FET.

Maximum Power Dissipation (Abs): 106 W

High power dissipation rating indicates the FET's capability to dissipate heat effectively, ensuring stable operation under heavy loads.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design aids in space-saving on the PCB, making it suitable for applications with size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides low gate capacitance and high switching speed, making the FET ideal for high-frequency applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature rating ensures reliable performance in harsh environments with elevated temperatures.

Transistor Element Material: SILICON

Silicon-based transistor element offers good thermal stability and high electron mobility, contributing to the efficiency of the FET.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature rating allows the FET to operate in cold environments without performance degradation.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and resistance to corrosion, ensuring reliable connections in various operating conditions.

Maximum Drain-Source On Resistance: 0.0017 ohm

Low on-resistance of the FET reduces power losses and improves efficiency in power switching applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options, allowing for different circuit configurations and designs.

Case Connection: DRAIN

Drain case connection simplifies circuit design and improves thermal management, enhancing the overall performance and reliability of the FET.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures quick and effective soldering during manufacturing, reducing production time and costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering in lead-free processes, meeting industry standards for environmental compliance.

Maximum Feedback Capacitance (Crss): 45 pF

Low feedback capacitance minimizes signal distortion and improves high-frequency response, making the FET suitable for RF and high-speed applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMJS1D7N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

338 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

185 A

Maximum Drain Current (ID):

185 A

Maximum Drain-Source On Resistance:

.0017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

45 pF

JESD-30 Code:

R-PDSO-X5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMJS1D7N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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