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NTMJS1D3N04CTWG

Onsemi

NTMJS1D3N04CTWG by Onsemi

NTMJS1D3N04CTWG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0013 ohm RDS(on). It is used in power applications due to its 128W Pdiss, -55 to 175 °C operating temp range, and built-in diode configuration.

Median Price

$4.020

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$4.020

100+ parts

$1.842

1k+ parts

$1.521

10k+ parts

$1.242

3,000

$4.020

$1.842

$1.521

$1.242

Flip Electronics (Authorized)

USA . 192,000 parts In-Stock

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Flip Electronics

USA . 282,071 parts In-Stock

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Vyrian

USA . 1,505 parts In-Stock

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Digiode

USA . 255 parts In-Stock

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255

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Microchip USA

USA . 9,625 parts In-Stock

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$16.282

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9,625

$16.282

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Problanco Electronics

Mexico . 7,834 parts In-Stock

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7,834

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 4,128 parts In-Stock

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Kulean Microsystems

USA . 2,518 parts In-Stock

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Corphita

USA . 2,479 parts In-Stock

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TANS Electronics

Latvia . 2,238 parts In-Stock

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Corohmni

South Africa . 273 parts In-Stock

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UHIMA Technologies

Türkiye . 264 parts In-Stock

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Overview

Experience the superior performance of the NTMJS1D3N04CTWG by Onsemi, a top-quality Power FET that guarantees reliability and efficiency. With a single configuration and built-in diode, this N-channel transistor is perfect for a wide range of applications. From power management to motor control, this product offers maximum power dissipation and an impressive avalanche energy rating, ensuring optimal performance in any operating mode. Trust Onsemi's expertise in semiconductor technology to deliver exceptional results, making the NTMJS1D3N04CTWG the smart choice for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better electron mobility and higher efficiency compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances performance by allowing for freewheeling of current in inductive loads.

Surface Mount: YES

Surface mount capability facilitates easy PCB assembly, saving time and effort during production.

Minimum DS Breakdown Voltage: 40 V

The minimum breakdown voltage of 40V ensures reliable operation and protection against voltage spikes or transients.

Maximum Pulsed Drain Current (IDM): 900 A

The high maximum pulsed drain current rating of 900A allows for handling sudden high current demands without compromising performance.

Maximum Power Dissipation (Abs): 128 W

With a maximum power dissipation of 128W, this FET can operate efficiently under high power conditions without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures reliable performance in harsh environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTMJS1D3N04CTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

739 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

235 A

Maximum Drain Current (ID):

235 A

Maximum Drain-Source On Resistance:

.0013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMJS1D3N04CTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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