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NTMFS4C06NT3G

Onsemi

NTMFS4C06NT3G by Onsemi

NTMFS4C06NT3G by Onsemi is a N-CHANNEL FET with 69A max drain current and 30.5W power dissipation. Ideal for high-power applications, it operates at up to 150 °C and features METAL-OXIDE SEMICONDUCTOR technology. Suitable for surface mount configurations, it offers reliability in various electronic designs.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 55,000 parts In-Stock

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Vyrian

USA . 6,145 parts In-Stock

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Digiode

USA . 1,267 parts In-Stock

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AZTECH Wire

Italy . 257 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 6,804 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,665 parts In-Stock

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Problanco Electronics

Mexico . 5,885 parts In-Stock

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Kulean Microsystems

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Corphita

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TANS Electronics

Latvia . 553 parts In-Stock

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UHIMA Technologies

Türkiye . 363 parts In-Stock

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Overview

Discover the NTMFS4C06NT3G by Onsemi, a top-quality N-CHANNEL FET that guarantees superior performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this FET is perfect for a wide range of applications. With a maximum drain current of 69A and power dissipation of 30.5W, this FET offers exceptional value and benefits to customers looking for high-quality components. Whether you're designing power supplies, motor controllers, or battery management systems, the NTMFS4C06NT3G is the ideal choice for your project. Trust in Onsemi for all your semiconductor needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used in low-side switch configurations, making them versatile for a variety of applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and allows for easy integration into existing systems.

Surface Mount: YES

Surface mount capability enables easy PCB assembly and saves space in the design.

Maximum Drain Current (Abs) (ID): 69 A

High maximum drain current allows for handling of high power loads, making this FET suitable for applications with heavy current requirements.

Maximum Power Dissipation (Abs): 30.5 W

With a high maximum power dissipation, this FET can operate efficiently even in high power applications, ensuring reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high performance and reliability, making this FET a durable choice for various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures stable performance in harsh environments or under heavy loads.

Terminal Finish: MATTE TIN

Matte Tin finish provides good solderability and ensures stable connections, prolonging the lifespan of the FET.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time helps in preventing overheating during the assembly process and ensures proper functionality of the FET.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering without damaging the FET, ensuring stable connections.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4C06NT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

69 A

Maximum Drain Current (ID):

69 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4C06NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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