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NTMFS4833NST3G

Onsemi

NTMFS4833NST3G by Onsemi

NTMFS4833NST3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max ID of 16A and 86.2W power dissipation in a small outline package style. Operating at up to 150 °C, it offers high performance in various electronic devices.

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 9,860 parts In-Stock

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Digiode

USA . 1,599 parts In-Stock

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AZTECH Wire

Italy . 709 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,951 parts In-Stock

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Kulean Microsystems

USA . 8,296 parts In-Stock

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TANS Electronics

Latvia . 5,368 parts In-Stock

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SupplyDigital Components

Austria . 3,106 parts In-Stock

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Perfect Parts

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Corphita

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UHIMA Technologies

Türkiye . 702 parts In-Stock

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Corohmni

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Problanco Electronics

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Overview

Unleash the power of innovation with the NTMFS4833NST3G by Onsemi, a cutting-edge small signal FET that redefines performance. From its high-quality construction to its advanced features like built-in diode and current sensor, this transistor is designed to excel in switching applications. Whether you're looking to optimize power efficiency or enhance circuit reliability, this product delivers unmatched value and benefits. Trust Onsemi's expertise and elevate your projects with the NTMFS4833NST3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used in high-power applications and offer low on-state resistance.

Configuration: SINGLE WITH BUILT-IN DIODE AND CURRENT AND KELVIN SENSOR

The built-in diode and sensors enhance the functionality and efficiency of the transistor.

Transistor Application: SWITCHING

Ideal for switching applications due to its high drain current capabilities.

Surface Mount: YES

The surface mount feature makes it easy to integrate into circuit boards.

Minimum DS Breakdown Voltage: 30 V

Provides a suitable breakdown voltage for various electronic applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easy to control and offer high input impedance.

Maximum Drain Current (Abs): 156 A

Capable of handling high current loads.

No. of Terminals: 8

Provides multiple connections for flexibility in circuit design.

Maximum Power Dissipation (Abs): 86.2 W

Can handle high power dissipation without overheating.

Package Style: SMALL OUTLINE

Compact package style saves space on circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high switching speeds and low power consumption.

Maximum Operating Temperature: 150 °C

Capable of operating in high-temperature environments.

Transistor Element Material: SILICON

Silicon material provides good conductivity and reliability.

Terminal Finish: TIN

Tin finish provides good solderability for easy installation.

Maximum Drain Current (ID): 16 A

Can handle high continuous drain currents.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering without damage for up to 30 seconds.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperatures during assembly.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4833NST3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

156 A

Maximum Drain Current (ID):

16 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4833NST3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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