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NTD4959NH-35G

Onsemi

NTD4959NH-35G by Onsemi

NTD4959NH-35G by Onsemi is a N-channel Power FET with 30V DS Breakdown Voltage and 130A IDM. Ideal for switching applications, it features 0.0125 ohm RDS(on) and 112.5mJ EAS rating. Package: PLASTIC/EPOXY, Configuration: SINGLE WITH DIODE, Technology: MOSFET.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 4,528 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 35 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,522 parts In-Stock

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TANS Electronics

Latvia . 8,290 parts In-Stock

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Problanco Electronics

Mexico . 5,125 parts In-Stock

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Kulean Microsystems

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Corohmni

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SupplyDigital Components

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UHIMA Technologies

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Corphita

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Overview

Unlock the power of efficient switching with the NTD4959NH-35G by Onsemi. Crafted with precision using cutting-edge technology, this N-Channel Power FET offers unparalleled performance and reliability. From enhancing your electronic projects to optimizing power management systems, this transistor's built-in diode and high breakdown voltage of 30V ensure seamless operation. Trust Onsemi's reputation for quality and innovation, and experience the value that the NTD4959NH-35G brings to your applications. Upgrade your circuits today with this powerhouse in a compact rectangular package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures the transistor is robust and can withstand tough environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics than P-channel transistors, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and can improve efficiency in certain applications.

Transistor Application: SWITCHING

Designed for switching applications, ensuring fast and efficient operation.

Minimum DS Breakdown Voltage: 30 V

High minimum breakdown voltage allows for safe operation in high voltage applications.

Maximum Pulsed Drain Current (IDM): 130 A

High maximum pulsed drain current enables the transistor to handle high current spikes without overheating.

Avalanche Energy Rating (EAS): 112.5 mJ

High avalanche energy rating ensures the transistor can withstand high energy spikes, improving overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in power switching applications.

Maximum Drain-Source On Resistance: 0.0125 ohm

Low on-resistance results in minimal power loss and high efficiency in the transistor.

Technical Specifications

Power Field Effect Transistors (FET) NTD4959NH-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

112.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.0125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

130 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4959NH-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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