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NTD4302-001

Onsemi

NTD4302-001 by Onsemi

NTD4302-001 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 30V DS Breakdown Voltage, 28A IDM, and 0.01 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with a max power dissipation of 75W at 150 °C.

Median Price

$0.267

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,001 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

4,001

-

$0.277

$0.230

$0.205

Verical

USA . 3,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.257

3,226

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-

-

$0.257

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 874 parts In-Stock

1+ parts

$0.217

100+ parts

-

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-

874

$0.217

-

-

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Vyrian

USA . 185 parts In-Stock

1+ parts

$0.228

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185

$0.228

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,443 parts In-Stock

1+ parts

$0.205

100+ parts

-

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2,443

$0.205

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Corohmni

South Africa . 330 parts In-Stock

1+ parts

$0.228

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-

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330

$0.228

-

-

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Kepictronics

USA . 15,000 parts In-Stock

1+ parts

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15,000

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TANS Electronics

Latvia . 7,005 parts In-Stock

1+ parts

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7,005

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Continental Prestige Electronics

USA . 4,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.186

10k+ parts

-

4,001

-

-

$0.186

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Problanco Electronics

Mexico . 3,163 parts In-Stock

1+ parts

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3,163

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Kulean Microsystems

USA . 2,603 parts In-Stock

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2,603

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SupplyDigital Components

Austria . 1,226 parts In-Stock

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1,226

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UHIMA Technologies

Türkiye . 945 parts In-Stock

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945

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Overview

Unleash the power of innovation with the NTD4302-001 by Onsemi! This high-quality Power Field Effect Transistor (FET) offers exceptional performance in switching applications, providing customers with reliable and efficient solutions. Manufactured by Onsemi, a trusted leader in semiconductor technology, this N-channel transistor boasts a single configuration with a built-in diode, enhancing its versatility and functionality. With a minimum DS breakdown voltage of 30V and maximum pulsing drain current of 28A, the NTD4302-001 delivers superior power handling capabilities. Elevate your projects to new heights with this cutting-edge component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making it suitable for various applications.

Minimum DS Breakdown Voltage: 30 V

Ensures reliability and stable operation within the specified voltage range.

Maximum Pulsed Drain Current (IDM): 28 A

Allows for high peak current handling capacity, making it suitable for demanding switching applications.

Maximum Power Dissipation (Abs): 75 W

Efficiently dissipates heat generated during operation, contributing to the overall reliability and longevity of the transistor.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without compromising performance, making it versatile for various industrial settings.

Technical Specifications

Power Field Effect Transistors (FET) NTD4302-001 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

8.4 A

Maximum Drain Current (ID):

8.4 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4302-001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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