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NTD4404NT4

Onsemi

NTD4404NT4 by Onsemi

NTD4404NT4 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 96A Pulsed Drain Current, and 0.00517 ohm Drain-Source Resistance. The transistor operates in ENHANCEMENT MODE and has a max power dissipation of 78.1W, making it ideal for high-power switching circuits.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Digiode

USA . 1,373 parts In-Stock

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Vyrian

USA . 1,051 parts In-Stock

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TANS Electronics

Latvia . 8,027 parts In-Stock

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SupplyDigital Components

Austria . 7,203 parts In-Stock

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Problanco Electronics

Mexico . 4,374 parts In-Stock

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Kulean Microsystems

USA . 4,221 parts In-Stock

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Corphita

USA . 2,322 parts In-Stock

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UHIMA Technologies

Türkiye . 650 parts In-Stock

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Corohmni

South Africa . 458 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NTD4404NT4 by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this N-CHANNEL Power FET with a built-in diode is designed for switching applications. Its high durability and maximum power dissipation of 78.1 W make it perfect for a wide range of applications. Experience the value and benefits of reliable performance and efficiency that this product offers. Upgrade your electronics with the NTD4404NT4 for optimal results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor.

Transistor Application: SWITCHING

Optimized for switching operations, ensuring reliable performance.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Minimum DS Breakdown Voltage: 24 V

Suitable for applications requiring a minimum breakdown voltage of 24V.

Package Shape: RECTANGULAR

Facilitates compact and space-efficient PCB layouts.

Terminal Form: GULL WING

Enables secure and reliable connections on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhances the transistor's performance in switching applications.

Maximum Pulsed Drain Current (IDM): 96 A

Capable of handling high current pulses effectively.

Avalanche Energy Rating (EAS): 90 mJ

Provides protection against avalanche breakdown events.

Maximum Drain Current (Abs) (ID): 12 A

Suitable for applications requiring a maximum drain current of 12A.

No. of Terminals: 2

Simplifies the connection setup of the transistor.

Maximum Power Dissipation (Abs): 78.1 W

Can dissipate high power levels effectively without overheating.

Package Style (Meter): SMALL OUTLINE

Ideal for compact and space-constrained designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers reliable and efficient performance in various applications.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures for extended periods.

Transistor Element Material: SILICON

Provides durability and reliability to the transistor.

Terminal Finish: TIN LEAD

Ensures good solderability and conductivity for terminal connections.

Maximum Drain Current (ID): 32 A

Capable of handling high continuous drain currents.

Maximum Drain-Source On Resistance: 0.00517 ohm

Provides low on-resistance for efficient power handling.

Terminal Position: SINGLE

Simplifies the connection setup and PCB layout.

Case Connection: DRAIN

Offers a convenient connection point for the drain terminal.

Technical Specifications

Power Field Effect Transistors (FET) NTD4404NT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

90 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.00517 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4404NT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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