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NTD4302G

Onsemi

NTD4302G by Onsemi

NTD4302G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 30V DS Breakdown Voltage, 28A Pulsed Drain Current, and 0.01 ohm Drain-Source On Resistance. This small outline transistor operates in ENHANCEMENT MODE at up to 150 °C, making it ideal for high-power switching circuits.

Median Price

$0.552

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,125 parts In-Stock

1+ parts

-

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$0.542

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$0.450

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$0.401

35,125

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$0.542

$0.450

$0.401

Verical

USA . 32,125 parts In-Stock

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$0.562

10k+ parts

$0.501

32,125

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-

$0.562

$0.501

Distributors (In-Stock)

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Digiode

USA . 329 parts In-Stock

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$0.422

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329

$0.422

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Vyrian

USA . 6,541 parts In-Stock

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DF Sales Co.

USA . 509 parts In-Stock

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509

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DF Sales Co.

USA . 509 parts In-Stock

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509

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Sea View Technologies

USA . 110 parts In-Stock

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Bristol Electronics

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Corphita

USA . 1,586 parts In-Stock

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$0.400

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1,586

$0.400

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Corohmni

South Africa . 372 parts In-Stock

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$0.444

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372

$0.444

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AZTECH Wire

Italy . 326 parts In-Stock

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$18.910

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Kepictronics

USA . 20,000 parts In-Stock

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SupplyDigital Components

Austria . 4,533 parts In-Stock

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TANS Electronics

Latvia . 2,382 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,985 parts In-Stock

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Kulean Microsystems

USA . 1,192 parts In-Stock

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UHIMA Technologies

Türkiye . 261 parts In-Stock

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Overview

Discover the power and efficiency of the NTD4302G by Onsemi, a cutting-edge Power Field Effect Transistor designed for high-performance switching applications. With a reputation for quality and reliability, Onsemi delivers unparalleled value with this N-CHANNEL transistor featuring a built-in diode. Whether you're in need of enhanced power management solutions or optimized circuit performance, the NTD4302G offers the benefits and advantages that customers demand. Trust Onsemi for superior technology and innovation in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors generally have better conductivity and efficiency compared to P-Channel transistors, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides additional functionality, making this product versatile and convenient to use.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product offers fast switching speeds and low power consumption, ideal for electronic devices that require efficient power management.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in the manufacturing process.

Maximum Drain-Source On Resistance: 0.01 ohm

With a low drain-source on resistance, this product minimizes power loss and heat generation, making it highly efficient for various applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4302G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

8.4 A

Maximum Drain Current (ID):

8.4 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4302G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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