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NTD4302-001G

Onsemi

NTD4302-001G by Onsemi

NTD4302-001G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 30V DS Breakdown Voltage, 28A IDM, and 0.01 ohm RDS(on). This METAL-OXIDE SEMICONDUCTOR device operates in ENHANCEMENT MODE at up to 150 °C, making it ideal for high-power switching circuits.

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SupplyDigital Components

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TANS Electronics

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Problanco Electronics

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Kulean Microsystems

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UHIMA Technologies

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Overview

Upgrade your power management system with the NTD4302-001G by Onsemi. This N-CHANNEL Power FET offers unparalleled quality and reliability, making it the perfect choice for switching applications. With a maximum pulsed drain current of 28A and a low on-resistance of just 0.01 ohm, this transistor delivers outstanding performance. Whether you're looking to improve efficiency in automotive, industrial, or consumer electronics, the NTD4302-001G provides the value and benefits you need to take your project to the next level. Trust Onsemi for cutting-edge technology and superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this FET lightweight and durable, making it easy to handle and less prone to damage during installation.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower conduction losses and faster switching speeds compared to P-channel FETs, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to prevent damage from reverse voltage spikes, improving the reliability of the FET in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, making it ideal for power control in various electronic devices.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle higher voltage levels without experiencing breakdown, ensuring reliable performance in high-power circuits.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and efficient use of board space, making it convenient for integration into electronic circuits.

Maximum Pulsed Drain Current (IDM): 28 A

With a high pulsed drain current rating, this FET can handle brief current spikes without damage, making it suitable for applications with varying load conditions.

Avalanche Energy Rating (EAS): 722 mJ

The high avalanche energy rating indicates that this FET can withstand high-energy pulses without failing, ensuring reliable operation in harsh environments.

No. of Terminals: 3

Having three terminals allows for easy connection in a circuit, simplifying the installation process and ensuring proper functionality of the FET.

Package Style (Meter): IN-LINE

The in-line package style provides a compact design, making it suitable for applications where space is limited while maintaining efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this FET suitable for energy-efficient applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making this FET a durable and long-lasting choice for electronic circuits.

Maximum Drain Current (ID): 8.4 A

With a high maximum drain current rating, this FET can handle high current loads without overheating, ensuring stable operation in power circuits.

Maximum Drain-Source On Resistance: 0.01 ohm

The low on-resistance of 0.01 ohm minimizes power losses and improves efficiency in power switching applications, making this FET a cost-effective choice.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and ensures proper orientation in a circuit, preventing installation errors and ensuring reliable performance.

Case Connection: DRAIN

The drain connection allows for efficient dissipation of heat generated during operation, ensuring consistent performance and reliability of the FET in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4302-001G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

722 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

8.4 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4302-001G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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