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NTD4404N1

Onsemi

NTD4404N1 by Onsemi

NTD4404N1 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 96A IDM, and 0.00517 ohm RDS(on). With an EAS of 90mJ and operating up to 150 °C, it's ideal for high-power switching circuits.

Median Price

$0.251

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 121,490 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

121,490

-

$0.251

$0.208

$0.186

DigiKey

USA . 121,490 parts In-Stock

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-

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$0.260

121,490

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$0.260

Verical

USA . 121,490 parts In-Stock

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$0.232

121,490

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$0.232

Distributors (In-Stock)

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Digiode

USA . 2,285 parts In-Stock

1+ parts

$0.196

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2,285

$0.196

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Vyrian

USA . 1,092 parts In-Stock

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$0.206

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1,092

$0.206

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Distributors (Availability)

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Ampacity Inc.

Singapore . 121,349 parts In-Stock

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$0.175

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121,349

$0.175

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Corphita

USA . 623 parts In-Stock

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$0.185

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623

$0.185

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Corohmni

South Africa . 440 parts In-Stock

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$0.206

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440

$0.206

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Continental Prestige Electronics

USA . 121,490 parts In-Stock

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$0.163

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121,490

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$0.163

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QUARKTWIN TECHNOLOGY LTD

USA . 28,519 parts In-Stock

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Kulean Microsystems

USA . 8,276 parts In-Stock

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8,276

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TANS Electronics

Latvia . 7,268 parts In-Stock

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7,268

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SupplyDigital Components

Austria . 6,639 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,516 parts In-Stock

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6,516

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Problanco Electronics

Mexico . 2,299 parts In-Stock

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2,299

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UHIMA Technologies

Türkiye . 868 parts In-Stock

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GreenTree Electronics

Israel . 75 parts In-Stock

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Overview

Looking for a reliable Power Field Effect Transistor for your switching applications? Look no further than the NTD4404N1 by Onsemi. With its high-quality construction and built-in diode, this N-CHANNEL transistor offers superior performance and reliability. Whether you're working on industrial automation or power management projects, this transistor has got you covered. Trust Onsemi's expertise in semiconductor technology to deliver the value and benefits you need for your next project. Choose the NTD4404N1 for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight, durable, and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high efficiency and fast switching speed, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can protect against reverse currents, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and minimal power loss during operation.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperature environments, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4404N1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

90 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.00517 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4404N1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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