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NTD4809NT4G

Onsemi

NTD4809NT4G by Onsemi

NTD4809NT4G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 30V DS Breakdown Voltage, 130A IDM, and 0.014 ohm RDS(on). With a max power dissipation of 52W and operating temperature of 175°C, it is ideal for high-power switching circuits in various electronic devices.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,742 parts In-Stock

1+ parts

$0.670

100+ parts

$0.361

1k+ parts

$0.289

10k+ parts

-

1,742

$0.670

$0.361

$0.289

-

Rochester

USA . 59,246 parts In-Stock

1+ parts

-

100+ parts

$0.446

1k+ parts

$0.370

10k+ parts

$0.330

59,246

-

$0.446

$0.370

$0.330

DigiKey

USA . 59,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.560

10k+ parts

-

59,246

-

-

$0.560

-

Verical

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.463

10k+ parts

$0.413

50,000

-

-

$0.463

$0.413

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,229 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

-

1,229

$0.348

-

-

-

Bristol Electronics

USA . 657 parts In-Stock

1+ parts

$1.380

100+ parts

$0.552

1k+ parts

$0.386

10k+ parts

-

657

$1.380

$0.552

$0.386

-

Vyrian

USA . 61,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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61,825

-

-

-

-

Chip Stock

USA . 18,750 parts In-Stock

1+ parts

-

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18,750

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-

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Cyclops Electronics Ltd

UK . 2,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,276

-

-

-

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ComSIT Distribution GmbH

Germany . 1,868 parts In-Stock

1+ parts

-

100+ parts

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1,868

-

-

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Dan-Mar Components

USA . 657 parts In-Stock

1+ parts

-

100+ parts

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657

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J2 Sourcing AB

Sweden . 630 parts In-Stock

1+ parts

-

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630

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PC Components Company LLC

USA . 84 parts In-Stock

1+ parts

-

100+ parts

-

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84

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

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10

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 58,425 parts In-Stock

1+ parts

$0.256

100+ parts

-

1k+ parts

-

10k+ parts

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58,425

$0.256

-

-

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Corohmni

South Africa . 430 parts In-Stock

1+ parts

$0.301

100+ parts

-

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-

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430

$0.301

-

-

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Corphita

USA . 1,596 parts In-Stock

1+ parts

$0.329

100+ parts

-

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-

10k+ parts

-

1,596

$0.329

-

-

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Continental Prestige Electronics

USA . 97,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.336

10k+ parts

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97,985

-

-

$0.336

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Perfect Parts

USA . 14,530 parts In-Stock

1+ parts

-

100+ parts

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14,530

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Kepictronics

USA . 9,450 parts In-Stock

1+ parts

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100+ parts

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9,450

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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100+ parts

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8,000

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Kulean Microsystems

USA . 7,265 parts In-Stock

1+ parts

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7,265

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SupplyDigital Components

Austria . 5,685 parts In-Stock

1+ parts

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5,685

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Problanco Electronics

Mexico . 4,888 parts In-Stock

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4,888

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TANS Electronics

Latvia . 4,723 parts In-Stock

1+ parts

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4,723

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A-Z Elektronik GmbH

Germany . 2,835 parts In-Stock

1+ parts

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2,835

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Cyclops Electronics Ltd (Excess)

UK . 2,378 parts In-Stock

1+ parts

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2,378

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 869 parts In-Stock

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869

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Futuretech Components

Singapore . 510 parts In-Stock

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510

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UHIMA Technologies

Türkiye . 215 parts In-Stock

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215

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Overview

Experience the power of innovation with the NTD4809NT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are ideal for a wide range of switching applications. This N-CHANNEL transistor boasts a single configuration with a built-in diode, offering enhanced performance and reliability. With a maximum power dissipation of 52W and an avalanche energy rating of 91mJ, this transistor provides customers with exceptional value and efficiency. Trust Onsemi to provide cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY -

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL -

The N-Channel design allows for efficient current flow, making this transistor a reliable choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE -

The built-in diode simplifies circuit design and enhances the efficiency of the transistor in switch applications.

Transistor Application: SWITCHING -

Designed specifically for switching applications, this transistor offers high performance and reliability in controlling electrical signals.

Surface Mount: YES -

The ability to surface mount the transistor makes it easy to integrate into compact electronic devices and circuit boards.

Minimum DS Breakdown Voltage: 30 V -

With a minimum breakdown voltage of 30V, this transistor can handle a wide range of voltage levels, increasing its versatility.

Package Shape: RECTANGULAR -

The rectangular shape of the package allows for easy mounting and integration in circuit designs.

Terminal Form: GULL WING -

The gull wing terminal form provides a reliable connection for the transistor, ensuring stable performance in various applications.

Operating Mode: ENHANCEMENT MODE -

Operating in enhancement mode allows for fast and efficient switching operations, making this transistor ideal for high-speed applications.

Maximum Pulsed Drain Current (IDM): 130 A -

With a high maximum pulsed drain current, this transistor can handle large transient currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 91 mJ -

The high avalanche energy rating ensures the transistor can withstand high-energy events, enhancing its reliability in rugged conditions.

Maximum Drain Current (Abs) (ID): 58 A -

The high maximum drain current rating makes this transistor suitable for applications requiring high current handling capabilities.

No. of Terminals: 2 -

With two terminals, this transistor is easy to install and provides a simple interface for circuit connections.

Maximum Power Dissipation (Abs): 52 W -

The high power dissipation rating allows this transistor to handle high power loads, making it a reliable choice for power applications.

Package Style (Meter): SMALL OUTLINE -

The small outline package style saves space and allows for compact circuit designs, making this transistor ideal for applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR -

The metal-oxide semiconductor technology provides high performance and reliability, making this transistor a top choice for demanding applications.

Maximum Operating Temperature: 175 °C -

With a high maximum operating temperature, this transistor can withstand extreme heat conditions, ensuring stable performance in harsh environments.

Transistor Element Material: SILICON -

The silicon-based element material ensures efficient conduction and reliability, making this transistor ideal for various applications.

Terminal Finish: MATTE TIN -

The matte tin terminal finish provides a durable and reliable connection for the transistor, ensuring long-lasting performance in the circuit.

Maximum Drain Current (ID): 9 A -

With a maximum drain current rating of 9A, this transistor can handle moderate current levels, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.014 ohm -

The low drain-source on resistance minimizes power loss and improves efficiency, making this transistor a cost-effective choice for power applications.

Terminal Position: SINGLE -

The single terminal position simplifies installation and circuit design, allowing for easy integration into various applications.

Case Connection: DRAIN -

The drain case connection helps dissipate heat efficiently, ensuring the transistor operates at optimal temperatures for reliable performance.

Maximum Time At Peak Reflow Temperature (s): 30 -

This transistor can withstand peak reflow temperatures for up to 30 seconds, making it easy to integrate into circuit boards during manufacturing.

Peak Reflow Temperature °C: 260 -

With a peak reflow temperature of 260°C, this transistor can endure high-temperature soldering processes, ensuring reliable solder joints for long-term performance.

Technical Specifications

Power Field Effect Transistors (FET) NTD4809NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

91 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

130 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4809NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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